v1.3
®
ProASIC3 Flash Family FPGAs
with Optional Soft ARM Support
®
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
Features and Benefits
• 15 k to 1 M System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/Os
High Capacity
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
†
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X and LVCMOS
2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and above)
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
• Live at Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• I/O Registers on Input, Output, and Enable Paths
‡
• Hot-Swappable and Cold Sparing I/Os
†
• Programmable Output Slew Rate and Drive Strength
• Retains Programmed Design when Powered Off
High Performance
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL†
• Six CCC Blocks, One with an Integrated PLL
• 350 MHz System Performance
†
• 3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
®
• Configurable
Phase-Shift,
Multiply/Divide,
Delay
Standard (AES) Decryption (except ARM-enabled ProASIC 3
†
Capabilities and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory†
devices) via JTAG (IEEE 1532–compliant)
®
• FlashLock to Secure FPGA Contents
Low Power
• 1 kbit of FlashROM User Nonvolatile Memory
• Core Voltage for Low Power
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
• Support for 1.5 V-Only Systems
†
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
• Low-Impedance Flash Switches
• True Dual-Port SRAM (except ×18)
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
ARM Processor Support in ProASIC3 FPGAs
®
• M1 ProASIC3 Devices—ARM Cortex™-M1 Soft Processor
Available with or without Debug
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Table 1 • ProASIC3 Product Family
ProASIC3 Devices
Cortex-M1 Devices
System Gates
A3P015
A3P030
A3P060 A3P125
A3P250
A3P400
A3P600
A3P1000
1
M1A3P250 M1A3P400
M1A3P600 M1A3P1000
15 k
128
384
–
30 k
256
768
–
60 k
512
1,536
18
125 k
1,024
3,072
36
250 k
2,048
6,144
36
400 k
–
600 k
–
1 M
–
Typical Equivalent Macrocells
VersaTiles (D-flip-flops)
RAM kbits (1,024 bits)
4,608-Bit Blocks
9,216
54
13,824
108
24
24,576
144
32
–
–
4
8
8
12
FlashROM Bits
1 k
–
1 k
–
1 k
Yes
1
1 k
Yes
1
1 k
Yes
1
1 k
Yes
1
1 k
Yes
1
1 k
Yes
1
2
Secure (AES) ISP
Integrated PLL in CCCs
–
–
3
VersaNet Globals
6
6
18
18
18
18
18
18
I/O Banks
2
2
2
2
4
4
4
4
Maximum User I/Os
49
81
96
133
157
194
235
300
Package Pins
5
QFN
QN68
QN48, QN68,
QN132
QN132
QN132
QN132
CS
CS121
VQ100
TQ144
VQFP
TQFP
PQFP
FBGA
VQ100
VQ100
TQ144
PQ208
VQ100
PQ208
PQ208
PQ208
PQ208
5
FG144
FG144 FG144/256
FG144/256/ FG144/256/ FG144/256/
484
484
484
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. AES is not available for ARM-enabled ProASIC3 devices.
3. Six chip (main) and three quadrant global networks are available for A3P060 and above.
4. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs handbook.
5. The M1A3P250 device does not support this package.
†
A3P015 and A3P030 devices do not support this feature.
‡ Supported only by A3P015 and A3P030 devices.
October 2009
I
© 2009 Actel Corporation