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A22H165 PDF预览

A22H165

更新时间: 2024-11-17 14:58:07
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 放大器
页数 文件大小 规格书
37页 2672K
描述
高性能G类立体声耳机放大器

A22H165 数据手册

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A22H165  
High-performance class-G stereo headphone amplifier  
Datasheet - production data  
Applications  
A22H165 - Flip-chip  
Cellular / smart phones  
Portable media player  
Wearable  
Fitness and healthcare  
Description  
Pinout (top view)  
The A22H165 is a class-G stereo headphone  
driver dedicated to high-performance audio, high  
power efficiency and space-constrained  
TOPVIEW  
GAIN  
EN  
D
C
B
A
INR-  
INR+  
INL+  
VOUTR  
CMS  
applications. It is based on the core technology of  
a low power dissipation amplifier combined with a  
high efficiency step-down DC-DC converter for  
supplying this amplifier. When powered by a  
battery, the internal step down DC-DC converter  
generates the appropriate voltage to the amplifier  
depending on the amplitude of the audio signal to  
supply the headsets. It achieves a total 2.1 mA  
current consumption at 100 µW output power (10  
dB crest factor). THD+N is 0.02 % maximum at 1  
kHz and PSRR is 100 dB at 217 Hz, which  
ensures a high audio quality of the device in a  
wide range of environments. The traditionally  
bulky output coupling capacitors can be removed.  
A dedicated common-mode sense pin removes  
parasitic ground noise. The A22H165 is designed  
to be used with an output serial resistor. It  
ensures unconditional stability over a wide range  
of capacitive loads. The A22H165 is packaged in  
a tiny 16-bump flip-chip package with a pitch of  
400 µm.  
C2  
PVSS  
C1  
HPVDD  
AGND  
VOUTL  
3
INL-  
4
AVDD  
2
SW  
1
Balls are undemeath  
Features  
Power supply range: 2.3 V to 4.8 V  
0.6 mA/channel quiescent current  
2.1 mA current consumption with  
100 µW/channel (10 dB crest factor)  
0.006% typical THD+N at 1 kHz  
100 dB typical PSRR at 217 Hz  
100 dB of SNR A-weighted at G = 0 dB  
Zero "pop and click"  
Gain settings: 0 dB and 6 dB  
Integrated high efficiency step-down converter  
Low standby current: 5 µA max  
Output-coupling capacitors removed  
Thermal shutdown  
Flip-chip package: 1.65 mm x 1.65 mm,  
400 µm pitch, 16 bumps  
July 2020  
DocID026036 Rev 2  
1/37  
This is information on a product in full production.  
www.st.com  

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