A19350
High Accuracy GMR Wheel Speed and Direction Sensor IC
FEATURES AND BENEFITS
DESCRIPTION
• GMR technology integrates high sensitivity MR
(magnetoresistive) sensor elements and high precision
BiCMOS circuits on a single silicon integrated circuit,
offering high accuracy, low magnetic field operation
• Integrated capacitor in a single overmolded miniature
package provides greater EMC robustness
• SolidSpeed Digital Architecture™ supports advanced
algorithms, maintaining performance in the presence of
extreme system-level disturbances, including vibration
immunity capability over the full target pitch
• Flexible orientation for xMR or Hall replacement
• ASIL B rating based on integrated diagnostics and
certified safety design process
The A19350 is a giant magnetoresistance (GMR) integrated
circuit (IC) that provides a user-friendly two-wire solution for
applicationswherespeedanddirectioninformationisrequired.
The small integrated package includes an integrated capacitor
and GMR IC in a single overmold design with an additional
molded lead-stabilizing bar for robust shipping and ease of
assembly.
The GMR-based IC is designed for use in conjunction with
front-biased ring magnet encoders. State-of-the-art GMR
technologywithindustry-leadingsignalprocessingalgorithms
accuratelyswitchinresponsetolow-leveldifferentialmagnetic
signals.ThehighsensitivityofGMRcombinedwithdifferential
sensing offers inherent rejection of interfering common-mode
magnetic fields and valid speed and direction over larger air
gaps, commonly required in wheel speed sensing applications.
• Two-wire current source output pulse-width protocol
supporting speed, direction, and ASIL
• EEPROM offers device traceability throughout the
production process
Patented GMR technology allows the same orientation as
Hall-effect for a drop-in solution in the application.
2
Integrated diagnostics are used to detect an IC failure which
impacts the output protocol’s accuracy, providing coverage
compatiblewithASILBcompliance.Built-inEEPROMscratch
memory offers traceability of the device throughout the IC’s
production process.
-
PACKAGE:
2-Pin SIP
The IC is offered in the UB package, which integrates the IC
and a high-temperature ceramic capacitor in a single overmold
SIP package for enhanced EMC performance. The 2-pin SIP
package is lead (Pb) free, with tin leadframe plating.
(suffix UB)
Not to scale
VCC
+
ADC
Output
–
Current
Generator
ESD
Analog-to-Digital
Front End
Amplification
Digital
Controller
GMR
Elements
and
Signal Conditioning
+
–
ADC
GND
EEPROM
Oscillator
Diagnostics
Regulator
Figure 1: Functional Block Diagram
A19350-DS
November 16, 2018
MCO-0000526