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NP276-110522-X PDF预览

NP276-110522-X

更新时间: 2024-02-10 03:45:16
品牌 Logo 应用领域
YAMAICHI
页数 文件大小 规格书
11页 725K
描述
IC Socket, BGA110, 110 Contact(s)

NP276-110522-X 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.69Is Samacsys:N
设备插槽类型:IC SOCKET使用的设备类型:BGA110
外壳材料:POLYETHERIMIDE触点数:110
Base Number Matches:1

NP276-110522-X 数据手册

 浏览型号NP276-110522-X的Datasheet PDF文件第2页浏览型号NP276-110522-X的Datasheet PDF文件第3页浏览型号NP276-110522-X的Datasheet PDF文件第4页浏览型号NP276-110522-X的Datasheet PDF文件第5页浏览型号NP276-110522-X的Datasheet PDF文件第6页浏览型号NP276-110522-X的Datasheet PDF文件第7页 
NP276 Series (Open Top)  
Ball Grid Array (BGA, 1.27mm Pitch)  
Specifications  
Part Number(Details)  
W
1,000M min. at 100V DC  
Dielectric Withstanding Voltage:100V AC for 1 minute  
Insulation Resistance:  
-
NP276  
Series No.  
-
-
*
1105 22  
(*)  
W
Contact Resistance:  
30m max. at 10mA/20mV max.  
Operating Temperature Range: –55°C to +150°C  
–40°C to +170°C  
No. of Contact Pins  
(.AC-types are depopulated  
base sockets)  
Contact Force:  
Mating Cycles:  
30g per pin approx.  
10,000 insetions  
Design Number  
Materials and Finish  
Housing:  
Polyetherimide (PEI), glass-filled  
Positioning Pin Options (see PCB):  
Polyethersulphone (PES), glass-filled  
Pos. pin 'A'  
With  
With  
Without  
Without  
Pos. pin 'B'  
With  
Without  
With  
Contacts:  
Plating:  
Beryllium Copper (BeCu)  
Gold over Nickel  
1 =  
2 =  
3 =  
4 =  
Features  
Without  
í Open top type sockets for BGA packages  
í Self contacting structure without upper pressing force (ZIF)  
í Contacting structure to nip the sides of solder balls to lower  
damage to the coplanarity of the solder balls  
Contact Terminal Length and Form  
Yamaichi's 2-point Tweezer Contact  
IC  
Ball  
Socket  
Base A  
Since the solder balls are touched  
by two contacts on each side,  
the solder ball damage can be  
minimized; additional features  
are low actuation force and  
compact socket size  
Contacts  
Socket  
Base B  
We have depopulated versions from existing NP276 base sockets.  
As new versions are continually being tooled up we rcommend  
to contact Yamaichi for your specific pin count  
and matching IC  
Applicable Base Socket and IC Dimensions  
IC Dimensions  
Body Size  
Grid Size  
Base Sockets  
Part  
Number  
Pin  
Count  
(see page)  
Pitch  
NP276-11904  
NP276-11904-3  
NP276-15316  
NP276-16951  
NP276-25626  
NP276-37206  
119  
119  
153  
169  
256  
372  
1.27  
1.27  
1.27  
1.27  
1.27  
1.27  
7 x 17  
7 x 17  
14 x 22  
14 x 22  
14 x 22  
17 x 17  
21 x 21  
27 x 27  
2
2
3
4
5
6
9 x 17  
13 x 13  
16 x 16  
20 x 20  
NP276-40009  
NP276-59608  
400  
596  
1.27  
1.27  
20 x 20  
26 x 26  
27 x 27  
35 x 35  
7
8
NP276-65227  
NP276-87318  
NP276-110522  
652  
873  
1.27  
1.27  
1.27  
28 x 28  
31 x 31  
35 x 35  
37.5 x 37.5  
40 x 40  
9
10  
11  
1105  
45 x 45  
Test & Burn-In  
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE  
DIMENSIONS IN MILLIMETER  

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