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B352F110T24_1 PDF预览

B352F110T24_1

更新时间: 2022-12-18 11:56:31
品牌 Logo 应用领域
VICOR 转换器
页数 文件大小 规格书
12页 1402K
描述
BCM Bus Converter

B352F110T24_1 数据手册

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B352F110T24  
TM  
BCM  
Bus Converter  
• 352 V to 11 V V•I ChipTM Converter  
• 240 Watt (360 Watt for 1 ms)  
• High density – up to 813 W/in3  
• Small footprint – 210 W/in2  
• Low weight – 0.5 oz (15 g)  
Typical efficiency 95%  
• 125°C operation (TJ)  
©
• <1 µs transient response  
• >2.6 million hours MTBF  
• No output filtering required  
Vin = 330.0 - 365 V  
Vout = 10.3 - 11.4 V  
Iout = 21.8 A  
K = 1/32  
• ZVS / ZCS isolated sine  
amplitude converter  
Rout = 15.0 mmax  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module is a high efficiency  
(>95%), narrow input range Sine Amplitude Converter  
(SAC) operating from a 330.0 to 365 Vdc primary bus to  
deliver an isolated low voltage secondary (ELV).  
The off-line BCM provides an isolated 10.3 -11.4 V  
distribution bus and is ideal for use in silver boxes and  
PFC front ends. Due to the fast response time and low  
noise of the BCM, the need for limited life aluminum  
electrolytic or tantalum capacitors at the input of POL  
converters is reduced—or eliminated—resulting in  
savings of board area, materials and total system cost.  
Parameter  
Values  
-1.0 to 400  
500  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 16.0  
4,242  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Case temperature  
Operating junction temperature(1)  
Storage temperature  
Note:  
Input to Output  
Continuous  
For 1 ms  
24.1  
32.7  
A
240  
W
Continuous  
For 1 ms  
360  
W
The BCM achieves a power density of 813 W/in3 in  
a V•I Chip package compatible with standard pick-and-  
place and surface mount assembly processes. The  
V•I Chip package provides flexible thermal management  
through its low junction-to-case and junction-to-board  
thermal resistance. Owing to its high conversion  
efficiency and safe operating temperature range, the  
BCM does not require a discrete heat sink in typical  
applications. Low junction-to-case and junction-to-lead  
thermal impedances assure low junction temperatures  
and long life in the harshest environments.  
225  
°C  
During reflow MSL 5  
T-Grade  
-40 to 125  
-40 to 125  
°C  
°C  
T-Grade  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
Part Numbering  
B
352  
F
110 T  
24  
Output Voltage  
Designator  
(=VOUT x10)  
Output Power  
Designator  
(=POUT/10)  
Bus Converter  
Module  
Input Voltage  
Designator  
Configuration  
F = J-lead  
Product Grade Temperatures (°C)  
Grade  
Storage Operating (TJ)  
T
-40 to125 -40 to125  
T = Through hole  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B352F110T24  
Rev. 2.5  
Page 1 of 12  

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