B352F110T24
TM
BCM
Bus Converter
• 352 V to 11 V V•I ChipTM Converter
• 240 Watt (360 Watt for 1 ms)
• High density – up to 813 W/in3
• Small footprint – 210 W/in2
• Low weight – 0.5 oz (15 g)
• Typical efficiency 95%
• 125°C operation (TJ)
©
• <1 µs transient response
• >2.6 million hours MTBF
• No output filtering required
Vin = 330.0 - 365 V
Vout = 10.3 - 11.4 V
Iout = 21.8 A
K = 1/32
• ZVS / ZCS isolated sine
amplitude converter
Rout = 15.0 mΩ max
Product Description
Absolute Maximum Ratings
The V•I Chip Bus Converter Module is a high efficiency
(>95%), narrow input range Sine Amplitude Converter
(SAC) operating from a 330.0 to 365 Vdc primary bus to
deliver an isolated low voltage secondary (ELV).
The off-line BCM provides an isolated 10.3 -11.4 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced—or eliminated—resulting in
savings of board area, materials and total system cost.
Parameter
Values
-1.0 to 400
500
Unit
Vdc
Vdc
Vdc
Vdc
Vdc
A
Notes
+In to -In
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.5 to 16.0
4,242
+Out to -Out
Isolation voltage
Output current
Peak output current
Output power
Peak output power
Case temperature
Operating junction temperature(1)
Storage temperature
Note:
Input to Output
Continuous
For 1 ms
24.1
32.7
A
240
W
Continuous
For 1 ms
360
W
The BCM achieves a power density of 813 W/in3 in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
225
°C
During reflow MSL 5
T-Grade
-40 to 125
-40 to 125
°C
°C
T-Grade
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
Part Numbering
B
352
F
110 T
24
Output Voltage
Designator
(=VOUT x10)
Output Power
Designator
(=POUT/10)
Bus Converter
Module
Input Voltage
Designator
Configuration
F = J-lead
Product Grade Temperatures (°C)
Grade
Storage Operating (TJ)
T
-40 to125 -40 to125
T = Through hole
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B352F110T24
Rev. 2.5
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