B048F120M30

更新时间： 2024-02-22 04:10:08

品牌	Logo	应用领域
VICOR		模拟IC 信号电路
页数	文件大小	规格书
15页	571K
描述
VI Chip - BCM Bus Converter Module

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技术参数
数据手册

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B048F120M30 技术参数

生命周期：	Obsolete	零件包装代码：	MODULE
包装说明：	,	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.83
模拟集成电路 - 其他类型：	ANALOG CIRCUIT	JESD-30 代码：	R-XXMA-J
长度：	32.5 mm	功能数量：	1
最高工作温度：	125 °C	最低工作温度：	-55 °C
封装主体材料：	UNSPECIFIED	封装形状：	RECTANGULAR
封装形式：	MICROELECTRONIC ASSEMBLY	认证状态：	Not Qualified
座面最大高度：	6.98 mm	最大供电电压 (Vsup)：	55 V
最小供电电压 (Vsup)：	38 V	标称供电电压 (Vsup)：	48 V
表面贴装：	YES	技术：	HYBRID
温度等级：	MILITARY	端子形式：	J BEND
端子位置：	UNSPECIFIED	宽度：	22 mm
Base Number Matches：	1

B048F120M30 数据手册

PRELIMINARY

V•I Chip Voltage Transformation Module

BCM

V•I Chip – BCM

Bus Converter Module

• 48 V to 12 V V•I Chip Converter

• 300 Watt (450 Watt for 1 ms)

• High density – 1200 W/in³

• Small footprint – 280 W/in²

• Low weight – 0.5 oz (14 g)

B048K120T30

K indicates BGA configuration. For other

mounting options see Part Numbering below.

• 96% efficiency

• 125°C operation

• <1 µs transient response

• 3.5 million hours MTBF

• No output filtering required

Vin = 38 - 55 V

Vout = 9.5 - 13.7 V

Iout = 25 A

K = 1/4

Rout = 13.9 mΩ max

• ZVS/ZCS isolated sine

amplitude converter

• Surface mount BGA or J-Lead

packages

Actual size

Product Description

Absolute Maximum Ratings

The V•I Chip Bus Converter Module (BCM) is a high

efficiency (>96%), narrow input range Sine Amplitude

Converter (SAC) operating from a 38 to 55 Vdc primary

bus to deliver an isolated 9.5 V to 13.7 V secondary. The

BCM may be used to power non-isolated POL converters

or as an independent 9.5 – 13.7 V source. Due to the

fast response time and low noise of the BCM, the need

for limited life aluminum electrolytic or tantalum

capacitors at the input of POL converters is reduced—or

eliminated—resulting in savings of board area, materials

and total system cost.

Parameter

+In to -In

Values

-1.0 to 60

100

Unit

Vdc

Notes

+In to -In

For 100 ms

PC to -In

-0.3 to 7.0

-0.5 to 30.0

2,250

+Out to -Out

Isolation voltage

Output current

Peak output current

Output power

Peak output power

Case temperature

Input to Output

Continuous

For 1 ms

37.5

300

Continuous

For 1 ms

450

The BCM achieves a power density of 1200 W/in³and

may be surface mounted with a profile as low as 0.16"

(4 mm) over the PCB. Its V•I Chip power package is

compatible with onboard or inboard surface mounting.

The V•I Chip package provides flexible thermal

management through its low Junction-to-Case and

Junction-to-BGA thermal resistance. Owing to its high

conversion efficiency and safe operating temperature

range, the BCM does not require a discrete heat sink in

typical applications. It is also available with heat sink

options, assuring low junction temperatures and long

life in the harshest environments.

208

°C

During reflow

Operating junction temperature⁽¹⁾-40 to 125

-55 to 125

°C

T - Grade

M - Grade

Storage temperature

-40 to 150

-65 to 150

°C

T - Grade

M - Grade

Note:

(1) The referenced junction is defined as the semiconductor having the highest temperature.

This temperature is monitored by a shutdown comparator.

Part Numbering

048 K 120 T

Output Voltage

Designator

(=V^OUTx10)

Output Power

Designator

(=POUT/10)

Bus Converter

Module

Input Voltage

Designator

Configuration Options

Product Grade Temperatures (°C)

= Onboard (Figure 20)

Grade

Storage Operating

K = Inboard (Figure 19)

-40 to150 -40 to125

-65 to150 -55 to125

vicorpower.com

800-735-6200

V•I Chip Bus Converter Module

B048K120T30

Rev. 1.0

Page 1 of 16

12 3 4 5 6 7...15

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