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B048F030M21 PDF预览

B048F030M21

更新时间: 2024-01-25 08:17:04
品牌 Logo 应用领域
VICOR 模拟IC信号电路
页数 文件大小 规格书
15页 566K
描述
VI Chip - BCM Bus Converter Module

B048F030M21 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:MODULE包装说明:,
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.84Is Samacsys:N
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-XXMA-J
JESD-609代码:e4长度:32.5 mm
湿度敏感等级:5功能数量:1
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:6.98 mm
最大供电电压 (Vsup):55 V最小供电电压 (Vsup):38 V
标称供电电压 (Vsup):48 V表面贴装:YES
技术:HYBRID温度等级:MILITARY
端子面层:NICKEL PALLADIUM GOLD端子形式:J BEND
端子位置:UNSPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:22 mmBase Number Matches:1

B048F030M21 数据手册

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PRELIMINARY  
BCM  
TM  
V•I Chip – BCM  
Bus Converter Module  
• 48 V to 3 V V•I Chip Converter  
• 210 Watt (315 Watt for 1 ms)  
• High density – 284 A/in3  
• Small footprint – 60 A/in2  
• Low weight – 0.5 oz (14 g)  
B048K030T21  
K indicates BGA configuration. For other  
mounting options see Part Numbering below.  
• 94% efficiency  
• 125°C operation  
©
• <1 µs transient response  
• 3.5 million hours MTBF  
• No output filtering required  
Vin = 38 - 55 V  
Vout = 2.38 - 3.43 V  
Iout = 70 A  
K = 1/16  
Rout = 2.0 mmax  
• ZVS/ZCS isolated sine  
amplitude converter  
• Surface mount BGA or J-Lead  
packages  
Actual size  
Product Description  
Absolute Maximum Ratings  
The V•I Chip Bus Converter Module (BCM) is a high  
efficiency (>94%), narrow input range Sine Amplitude  
Converter (SAC) operating from a 38 to 55 Vdc primary  
bus to deliver an isolated 2.38 V to 3.43 V secondary.  
The BCM may be used to power non-isolated POL  
converters or as an independent 2.38 – 3.43 V source.  
Due to the fast response time and low noise of the  
BCM, the need for limited life aluminum electrolytic or  
tantalum capacitors at the input of POL converters is  
reduced—or eliminated—resulting in savings of board  
area, materials and total system cost.  
Parameter  
+In to -In  
Values  
-1.0 to 60  
100  
Unit  
Vdc  
Vdc  
Vdc  
Vdc  
Vdc  
A
Notes  
+In to -In  
For 100 ms  
PC to -In  
-0.3 to 7.0  
-0.5 to 6.0  
2,250  
70  
+Out to -Out  
Isolation voltage  
Output current  
Peak output current  
Output power  
Peak output power  
Case temperature  
Input to Output  
Continuous  
For 1 ms  
105  
A
210  
W
Continuous  
For 1 ms  
315  
W
The BCM achieves a current density of 284 A/in3 and  
may be surface mounted with a profile as low as 0.16"  
(4 mm) over the PCB. Its V•I Chip power package is  
compatible with onboard or inboard surface mounting.  
The V•I Chip package provides flexible thermal  
management through its low Junction-to-Case and  
Junction-to-BGA thermal resistance. Owing to its high  
conversion efficiency and safe operating temperature  
range, the BCM does not require a discrete heat sink in  
typical applications. It is also available with heat sink  
options, assuring low junction temperatures and long  
life in the harshest environments.  
208  
°C  
During reflow  
Operating junction temperature(1) -40 to 125  
-55 to 125  
°C  
°C  
T - Grade  
M - Grade  
Storage temperature  
-40 to 150  
-65 to 150  
°C  
°C  
T - Grade  
M - Grade  
Note:  
(1) The referenced junction is defined as the semiconductor having the highest temperature.  
This temperature is monitored by a shutdown comparator.  
Part Numbering  
B
048 K 030 T  
21  
Output Voltage  
Designator  
(=VOUT x10)  
Output Power  
Designator  
(=POUT/10)  
Bus Converter  
Module  
Input Voltage  
Designator  
Configuration Options  
Product Grade Temperatures (°C)  
F
= Onboard (Figure 20)  
Grade  
Storage Operating  
K = Inboard (Figure 19)  
T
M
-40 to150 -40 to125  
-65 to150 -55 to125  
vicorpower.com  
800-735-6200  
V•I Chip Bus Converter Module  
B048K030T21  
Rev. 1.0  
Page 1 of 15  

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