PC B La yo u t Dra w in g
fo r Min i Size Mo d u le
PIN LEGEND
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.254
0.131
Mini
Symbol
FARM
Pin
Number
Function
Symbol
Function
Pin Dia.
(Inches / mm)
0.027
7 x Ø 0.233
FREE OF SOLDER MASK
0.050
TYP
1
2
3
4
5
6
7
8
9
+
PC
PR
–
+IN
N
Neutral
EMI
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.230
0.115
Prim. Control EMI GRD
Parallel
–IN
0.027
NC
L
–
EN
ST
BOK
+
Line
– Out
Enable
Strap
BUS OK
+ OUT
Ø 0.016 NON PLATED THRU
7 PL
0.102
0.313
–
–OUT
–S
SC
+S
+
– Sense
Sec. Control
+Sense
+Out
0.265
0.050
TYP
0.328
0.467
0.138
0.266
0.340
2.096
53,24
38°
SEE DETAIL A
2.000
50,8
PCB
SURFMATE INPUT
CONNECTOR
0.027
0.069
Ø 0.032 ± 0.003
3 VIA HOLES
0.065
0.027
0.300
7,62
0.250
6,36
0.027
0.56
MAX
Ø 0.032 ± 0.003
16 VIA HOLES
0.063
1,59
0.536
13,61
0.440
11,18
DETAIL A
4
5
3
6
2
8
1
9
MODULE
0.265
6,73
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
4
5
3
6
2
8
1
9
6 x ø0.064 ± 0.003
1.900
48,26
1,63 ±0,08
(#52 DRILL)
1.600
40,64
2.430
61,72
PCB
1.98
50,3
Ø 0.032 ± 0.003
29 VIA HOLES
4 x ø 0.130 ± 0.003
3,30 ± 0,08
7
MODULE
EXCHANGE
TOOL-
BOTH ENDS
(PARTIAL)
0.06
1,6
0.027
7
PLATED THRU HOLE
FOR STANDOFF MTG
Ø 0.032 ± 0.003
3 VIA HOLES
0.230
TYP
0.226
0.034
0.063
1,59
0.300
7,62
0.115
0.027
0.536
13,61
0.065
0.152
0.80
20,3
0.065
2 x 0.125 ± 0.002
3,18 ± 0,05
0.251
6,36
55°
0.097
2,47
0.069
0.266
7 x Ø 0.016
0.202
0.400
10,16
0.491
12,47
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
0.604
0.350
0.340
0.700
17,78
0.050
TYP
0.250
6,35
MODULE
EXCHANGE
TOOL
3
2
0.277
SEE DETAIL B
MODULE
BASEPLATE
1.000
25,4
1
0.15
3,8
0.38
9,5
PCB
1.400
35,56
0.027
0.050
TYP
15°
0.80 ± 0.03
20,3 ± 0,8
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
SURFMATE OUTPUT
CONNECTOR
1.25
31,6
0.034
1.900 ± 0.002
48,26 ± 0,05
0.159
2 x Ø 0.316
FREE OF SOLDER MASK
0.318
0.006
REF
0,15
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
DETAIL B
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
BOTTOM OF
CAP TO TOP
OF PCB
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
DETAIL C
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
PRODUCT APPLICATION SPECIFICATIONS
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