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SMMS689 − AUGUST 1997
D
D
Organization:
− TM4SP64KPU . . . 4 194 304 x 64 Bits
− TM8SP64KPU . . . 8 388 608 x 64 Bits
D
High-Speed, Low-Noise Low-Voltage TTL
(LVTTL) Interface
D
Read Latencies 2 and 3 Supported
Single 3.3-V Power Supply
( 10% Tolerance)
D
Support Burst-Interleave and
Burst-Interrupt Operations
D
Designed for 66-MHz 4-Clock Systems
D
D
D
D
D
D
Burst Length Programmable to 1, 2, 4, 8,
and Full Page
D
JEDEC 168-Pin Dual-In-Line Memory
Module (DIMM) Without Buffer for Use With
Socket
Four Banks for On-Chip Interleaving
(Gapless Access)
D
D
TM4SP64KPU — Uses Four 64M-Bit
Synchronous Dynamic RAMs (SDRAMs)
(4M × 16-Bit) in Plastic Thin Small-Outline
Packages (TSOPs)
Ambient Temperature Range
0°C to 70°C
Gold-Plated Contacts
Pipeline Architecture
TM8SP64KPU — Uses Eight 64M-Bit
SDRAMs (4M × 16-Bit) in Plastic TSOPs
Byte-Read/Write Capability
Serial Presence-Detect (SPD) Using
EEPROM
D
D
Performance Ranges:
SYNCHRONOUS
CLOCK CYCLE
TIME
ACCESS TIME
CLOCK TO
OUTPUT
REFRESH
INTERVAL
t
t
t
t
t
CK3
CK2
AC3
AC3
REF
’xSP64KPU-10
10 ns
12 ns
15 ns
15 ns
9 ns
9 ns
64 ms
’xSP64KPU-12
9.5 ns
9.5 ns
description
The TM4SP64KPU is a 32M-byte, 168-pin dual-in-line memory module (DIMM). The DIMM is composed of
fourTMS664164DGE, 4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic thin small-outline package
(TSOP) mounted on a substrate with decoupling capacitors. See the TMS664164 data sheet (literature number
SMOS690).
The TM8SP64KPU is a 64M-byte, 168-pin DIMM. The DIMM is composed of eight TMS664164DGE,
4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic TSOP mounted on a substrate with decoupling
capacitors. See the TMS664164 data sheet (literature number SMOS690).
operation
The TM4SP64KPU operates as four TMS664164DGE devices that are connected as shown in the
TM4SP64KPU functional block diagram. The TM8SP64KPU operates as eight TMS664164DGE devices
connected as shown in the TM8SP64KPU functional block diagram.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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ꢩꢦ ꢧ ꢝ ꢭꢞ ꢨꢫ ꢣ ꢧ ꢦ ꢠꢟ ꢩꢦ ꢬ ꢦ ꢮꢠ ꢨꢢꢦ ꢞꢤꢯ ꢓ ꢫꢣ ꢡꢣ ꢥꢤ ꢦꢡ ꢝꢧ ꢤꢝ ꢥ ꢩꢣ ꢤꢣ ꢣꢞ ꢩ ꢠꢤ ꢫꢦꢡ
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Copyright 1997, Texas Instruments Incorporated
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ꢥ ꢫꢣ ꢞ ꢭꢦ ꢠꢡ ꢩꢝ ꢧ ꢥ ꢠꢞ ꢤꢝ ꢞꢪꢦ ꢤ ꢫꢦ ꢧ ꢦ ꢨꢡ ꢠꢩ ꢪꢥꢤ ꢧ ꢱ ꢝꢤꢫ ꢠꢪꢤ ꢞꢠꢤ ꢝꢥꢦ ꢯ
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