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TM4SP64KPU-10 PDF预览

TM4SP64KPU-10

更新时间: 2024-01-25 00:46:34
品牌 Logo 应用领域
德州仪器 - TI 时钟动态存储器内存集成电路
页数 文件大小 规格书
18页 278K
描述
4MX64 SYNCHRONOUS DRAM MODULE, 9ns, DMA168, DIMM-168

TM4SP64KPU-10 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:9 ns
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
JESD-30 代码:R-XDMA-N168内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:168字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM168封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:3.3 V
认证状态:Not Qualified刷新周期:4096
最大待机电流:0.008 A子类别:DRAMs
最大压摆率:0.86 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:MOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

TM4SP64KPU-10 数据手册

 浏览型号TM4SP64KPU-10的Datasheet PDF文件第2页浏览型号TM4SP64KPU-10的Datasheet PDF文件第3页浏览型号TM4SP64KPU-10的Datasheet PDF文件第4页浏览型号TM4SP64KPU-10的Datasheet PDF文件第5页浏览型号TM4SP64KPU-10的Datasheet PDF文件第6页浏览型号TM4SP64KPU-10的Datasheet PDF文件第7页 
TM4SP64KPU 4194304 BY 64-BIT  
TM8SP64KPU 8388608 BY 64-BIT  
SYNCHRONOUS DYNAMIC RAM MODULES  
SMMS689 – AUGUST 1997  
Organization:  
– TM4SP64KPU . . . 4 194 304 x 64 Bits  
– TM8SP64KPU . . . 8 388 608 x 64 Bits  
High-Speed, Low-Noise Low-Voltage TTL  
(LVTTL) Interface  
Read Latencies 2 and 3 Supported  
Single 3.3-V Power Supply  
(±10% Tolerance)  
Support Burst-Interleave and  
Burst-Interrupt Operations  
Designed for 66-MHz 4-Clock Systems  
Burst Length Programmable to 1, 2, 4, 8,  
and Full Page  
JEDEC 168-Pin Dual-In-Line Memory  
Module (DIMM) Without Buffer for Use With  
Socket  
Four Banks for On-Chip Interleaving  
(Gapless Access)  
TM4SP64KPU — Uses Four 64M-Bit  
Synchronous Dynamic RAMs (SDRAMs)  
(4M × 16-Bit) in Plastic Thin Small-Outline  
Packages (TSOPs)  
Ambient Temperature Range  
0°C to 70°C  
Gold-Plated Contacts  
Pipeline Architecture  
TM8SP64KPU — Uses Eight 64M-Bit  
SDRAMs (4M × 16-Bit) in Plastic TSOPs  
Serial Presence-Detect (SPD) Using  
EEPROM  
Byte-Read/Write Capability  
Performance Ranges:  
SYNCHRONOUS  
CLOCK CYCLE  
TIME  
ACCESS TIME  
CLOCK TO  
OUTPUT  
REFRESH  
INTERVAL  
t
t
t
t
t
CK3  
CK2  
AC3  
AC3  
REF  
’xSP64KPU-10  
’xSP64KPU-12  
10 ns  
12 ns  
15 ns  
15 ns  
9 ns  
9 ns  
64 ms  
9.5 ns  
9.5 ns  
description  
The TM4SP64KPU is a 32M-byte, 168-pin dual-in-line memory module (DIMM). The DIMM is composed of  
fourTMS664164DGE, 4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic thin small-outline package  
(TSOP) mounted on a substrate with decoupling capacitors. See the TMS664164 data sheet (literature number  
SMOS690).  
The TM8SP64KPU is a 64M-byte, 168-pin DIMM. The DIMM is composed of eight TMS664164DGE,  
4194304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic TSOP mounted on a substrate with decoupling  
capacitors. See the TMS664164 data sheet (literature number SMOS690).  
operation  
The TM4SP64KPU operates as four TMS664164DGE devices that are connected as shown in the  
TM4SP64KPU functional block diagram. The TM8SP64KPU operates as eight TMS664164DGE devices  
connected as shown in the TM8SP64KPU functional block diagram.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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