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74LVC1G3157DRYRG4 PDF预览

74LVC1G3157DRYRG4

更新时间: 2024-01-20 01:28:47
品牌 Logo 应用领域
德州仪器 - TI 复用器开关复用器或开关信号电路光电二极管输出元件PC
页数 文件大小 规格书
23页 932K
描述
SINGLE-POLE,DOUBLE-THROW ANALOG SWITCH

74LVC1G3157DRYRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SON
包装说明:SON-6针数:6
Reach Compliance Code:compliantHTS代码:8542.39.00.01
Factory Lead Time:12 weeks风险等级:5.2
Samacsys Confidence:4Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/1263849.1.4.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=1263849
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=12638493D View:https://componentsearchengine.com/viewer/3D.php?partID=1263849
Samacsys PartID:1263849Samacsys Image:https://componentsearchengine.com/Images/9/74LVC1G3157DRYRG4.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/1/74LVC1G3157DRYRG4.jpgSamacsys Pin Count:6
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Other
Samacsys Footprint Name:74LVC1G3157DRYRG4-3Samacsys Released Date:2020-04-23 13:04:07
Is Samacsys:N模拟集成电路 - 其他类型:SPDT
标称带宽:340 MHzJESD-30 代码:R-PDSO-N6
JESD-609代码:e4长度:1.45 mm
湿度敏感等级:1正常位置:NC
信道数量:1功能数量:1
端子数量:6标称断态隔离度:57 dB
通态电阻匹配规范:0.1 Ω最大通态电阻 (Ron):30 Ω
最高工作温度:125 °C最低工作温度:-40 °C
输出:COMMON OUTPUT封装主体材料:PLASTIC/EPOXY
封装代码:VSON封装等效代码:SOLCC6,.04,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:0.6 mm
子类别:Multiplexers or Switches最大供电电流 (Isup):0.035 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):2.3 V表面贴装:YES
最长断开时间:7.5 ns最长接通时间:14 ns
切换:BREAK-BEFORE-MAKE技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1 mmBase Number Matches:1

74LVC1G3157DRYRG4 数据手册

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SN74LVC1G3157  
SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH  
www.ti.com  
SCES424FJANUARY 2003REVISED FEBRUARY 2007  
FEATURES  
Low On-State Resistance, Typically 6 Ω  
(VCC = 4.5 V)  
1.65-V to 5.5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Useful for Both Analog and Digital  
Applications  
ESD Protection Exceeds JESD 22  
Specified Break-Before-Make Switching  
Rail-to-Rail Signal Handling  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
High Degree of Linearity  
1000-V Charged-Device Model (C101)  
High Speed, Typically 0.5 ns  
(VCC = 3 V, CL = 50 pF)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
B2  
GND  
B1  
S
1
2
3
6
5
4
B2  
GND  
B1  
S
1
2
3
6
5
4
B2  
GND  
B1  
S
VCC  
VCC  
A
VCC  
A
A
DRY PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
B1  
GND  
B2  
A
1
2
3
6
5
4
B2  
GND  
B1  
S
VCC  
VCC  
S
A
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes of  
up to VCC (peak) to be transmitted in either direction.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SON – DRY  
Reel of 3000  
SN74LVC1G3157YZPR  
_ _ _ C5_  
Reel of 5000  
Reel of 3000  
Reel of 3000  
Reel of 4000  
SN74LVC1G3157DRYR  
SN74LVC1G3157DBVR  
SN74LVC1G3157DCKR  
SN74LVC1G3157DRLR  
C5_  
CC5_  
C5_  
C5_  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
SOT (SOT-553) – DRL  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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