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AM42BDS640AGBC8IT PDF预览

AM42BDS640AGBC8IT

更新时间: 2024-01-17 08:48:32
品牌 Logo 应用领域
飞索 - SPANSION 闪存内存集成电路静态存储器
页数 文件大小 规格书
72页 1000K
描述
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AM42BDS640AGBC8IT 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.69最长访问时间:85 ns
JESD-30 代码:R-PBGA-B93内存集成电路类型:MEMORY CIRCUIT
混合内存类型:FLASH+SRAM端子数量:93
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA93,10X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH电源:1.8 V
认证状态:Not Qualified最大待机电流:0.000008 A
子类别:Other Memory ICs最大压摆率:0.025 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOMBase Number Matches:1

AM42BDS640AGBC8IT 数据手册

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For More Information  
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Publication Number 26445 Revision B Amendment 0 Issue Date November 1, 2002  

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