生命周期: | Active | Reach Compliance Code: | compliant |
风险等级: | 5.69 | 最长访问时间: | 85 ns |
JESD-30 代码: | R-PBGA-B93 | 内存集成电路类型: | MEMORY CIRCUIT |
混合内存类型: | FLASH+SRAM | 端子数量: | 93 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA93,10X12,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 1.8 V |
认证状态: | Not Qualified | 最大待机电流: | 0.000008 A |
子类别: | Other Memory ICs | 最大压摆率: | 0.025 mA |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
AM42BDS640AGBC8IT | AMD | 64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Mem |
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AM42BDS640AGBC8IT | SPANSION | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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|
AM42BDS640AGBC9FS | SPANSION | Memory Circuit, 4MX16, CMOS, PBGA93, 8 X 11.60 MM, FBGA-93 |
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|
AM42BDS640AGBC9IS | SPANSION | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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|
AM42BDS640AGBC9IS | AMD | 64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation, Burst Mode Flash Mem |
获取价格 |
|
AM42BDS640AGBC9IT | SPANSION | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
获取价格 |