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SFC2280-68.TM PDF预览

SFC2280-68.TM

更新时间: 2024-02-06 10:19:27
品牌 Logo 应用领域
商升特 - SEMTECH LTE
页数 文件大小 规格书
10页 240K
描述
Data Line Filter, Hybrid, Plastic

SFC2280-68.TM 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.84滤波器类型:DATA LINE FILTER
包装材料:PLASTIC电源:5
子类别:Data Line Filters技术:HYBRID
Base Number Matches:1

SFC2280-68.TM 数据手册

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SFC2280-68  
ChipClampΤΜ  
Headset Microphone EMI Filter and ESD Protection  
PROTECTION PRODUCTS  
Features  
Description  
The SFC2280-68 is a low pass filter array with inte-  
grated TVS diodes. It is designed to provide bidirec-  
tional filtering of EMI/RFI signals and electrostatic  
discharge (ESD) protection in portable electronic  
equipment. This state-of-the-art device utilizes solid-  
state silicon-avalanche technology for superior clamp-  
ing performance and DC electrical characteristics.  
They have been optimized for use on microphone ports  
in cellular phones and other portable electronics.  
‹ Flip Chip bidirectional EMI/RFI filter with  
integrated ESD protection  
‹ ESD protection to IEC 61000-4-2 (ESD) Level4,  
+/-15kV (air), +/-8kV (contact)  
‹ Filter performance: 20dB attenuation at 800MHz  
‹ Small chip scale package requires less board space  
‹ Low profile (< 0.65mm)  
‹ Bidirectional TVS to support negative voltages in  
audio applications  
‹ Maximum Dimensions: 1.5 x 1.0 x 0.65 mm  
‹ TVS Working voltage: 5V  
‹ Series Resistor: 68Ω  
The device has very low insertion loss in the pass band  
(to approximately 10MHz) and high attenuation at  
frequencies ranging from 800MHz to 3GHz. Each line  
features two stages of TVS diode protection. The TVS  
diodes provide effective suppression of ESD voltages  
in excess of 15kV (air discharge) and 8kV (contact  
‹ Solid-state technology  
Mechanical Characteristics  
discharge) per IEC 61000-4-2, level 4. The TVS diodes ‹ JEDEC MO-211, Variation BB, 0.50 mm Pitch Chip  
are bidirectional for supporting bipolar audio signals  
without distortion.  
Scale Package (CSP)  
‹ Marking : Marking Code + Chevron  
‹ Packaging : Tape and Reel  
The SFC2280-68 is a 6-bump, 0.5mm pitch flip chip  
array with a 3x2 bump grid. It measures 1.5 x 1.0 x  
0.65mm. This small outline makes the device espe-  
cially well suited for portable applications. The flip chip  
design results in lower inductance, virtually eliminating  
voltage overshoot due to leads and interconnecting  
bond wires.  
Applications  
‹ Cell Phone Handsets and Accessories  
‹ Personal Digital Assistants (PDA’s)  
‹ Notebook & Hand Held Computers  
‹ Digital Camcorders  
‹ Pagers  
‹ MP3 Players  
Circuit Diagram (Each Line)  
Schematic & PIN Configuration  
LOW PASS FILTER  
3 x 2 Grid CSP TVS (Bottom View)  
www.semtech.com  
Revision 3/04/2003  
1

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