Home Phone Networking
Magnetic Module
E L E C T R O N I C S I N C .
EPB5119S
• Designed to work with Broadcom’s BCM4210 •
• Integrated with 10/100 Base-T Magnetics •
• Robust Construction allows for IR Processes •
• 1500 Vrms Isolation •
• Temperature Range : -40°C to +85°C •
Electrical Parameters @ 25° C
CMRR
(dB Min.)
CMDR
(dB Min.)
Insertion Loss Return Loss
Attenuation
(dB Min.)
Turns Ratio
Cut-Off Freq.
(MHz Typ.)
(dB)
(dB Min.)
HPNA
Lower Upper
4.25 MHz -
9.75 MHz
6 MHz -
9 MHz
@
@
@
200 KHz -
22 MHz
Pins
Pins
@
@
Band
Band
1.1 MHz 22 MHz 54 MHz
29-28:1-3 29-28:3-4
1 MHz 100 MHz
3.5
11.5
1.0 - 2.2
-12
-60
-35
-50
-50
-50
-40
1:.667
1:.2
CMRR (dB Min.)
Return Loss (dB Min.)
Insertion Loss (dB Max.)
@ 200 MHz
1-80 MHz
-1.0
@ 100 MHz
-1.5
1-30 MHz
-18
@ 60 MHz
-12
@ 80 MHz
1-30 MHz
@ 100 MHz
10/100
Base-T
Transmit
-10
-10
-45
-35
-35
-10
-10
Receive
-1.0
-1.5
-18
-12
-45
•
•
Cable Side Impedance : 100 Ω
•
Crosstalk : -35 dB Min.
Schematic
1
2
3
4
HPNA Filter Input Impedance
With 44.2 Ω load across pins 1 and 2, please refer to the table below.
The magnitude of the input impedance shall be > 10 Ω from 0-30 MHz
and shall conform to the following lower-bound mask:
29 (Phone Line Tip)
Transmit
BPF
28 (Phone Line Ring)
Frequency
Range
Minimum
Impedance
Ω
Frequency
Range
Minimum
Impedance
Ω
Receive
HPNA Filter
(KHz)
(KHz)
40
0 < f < = 0.285
0.285 < f < = 2.85
2.85 < f < = 28.5
28.5 < f < = 95
95 < f < = 190
190 < f < = 285
285 < f < = 380
380 < f < = 475
475 < f < = 570
570 < f < = 665
665 < f < = 760
760 < f < = 855
855 < f < = 950
950 < f < = 1000
1 M
1000 < f < = 1400
1400 < f < = 2300
2300 < f < = 2850
2850 < f < = 3085
3085 < f < = 3725
3725 < f < = 3935
3935 < f < = 4000
10000 < f < =10450
10450 < f < =10925
10925 < f < = 13125
13125 < f < = 14175
14175 < f < = 16800
16800 < f < = 21000
21000 < f < = 30000
175
100
50
Transmit (10/100 Base-T)
Receive (10/100 Base-T)
100 K
10 K
4.0 K
2.0 K
1.4 K
1.0 K
850
25
22
16
19
25
10
26
24
23
21
15
17
18
20
25
50
40
1: 1
1: 1
700
25
600
10
Package
525
25
A
450
50
400
100
50
N
J
350
Dimensions
(Inches)
Pin 1
I.D.
40
1
21
(Millimeters)
Max. Nom.
PCA
Solder Pad Layout
P
EPB5119S
Date Code
Dim.
Min.
Max. Nom. Min.
B
Q
20
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
Q
1.110 1.130 1.120 28.19 28.70 28.45
.470
.250
---
.010
---
.490
.270
---
.480 11.94 12.45 12.19
.260
.950
.012
.050
6.35
---
6.86
---
.381
---
6.60
24.13
.305
D
M
.015
---
.254
---
1.27
.590
.016
.008
---
.610
.022
.012
---
.600 14.99 15.49 15.24
.019
.010
.085
---
.035
.030
.050
.090
.670
.406
.203
---
.559
.305
---
.483
.254
2.16
---
.889
.762
1.27
2.29
17.02
E
C
K
0°
8°
0°
8°
.025
---
.045
---
.635
---
1.14
---
L
I
---
---
---
---
H
F
G
---
---
---
---
---
---
---
---
CSB5119S Rev. - 11/7/00
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
Product performance is limited to specified parameters. Data is subject to change without prior notice.