NUF9002FC
Low Capacitance 10 Line
EMI Filter with ESD
Protection
This device is a ten−line EMI filter array for wireless applications.
Greater than −25 dB attenuation is obtained at frequencies from
900 MHz to 3.0 GHz. ESD protection is provided across all
capacitors.
http://onsemi.com
LOW−PASS FILTER
INPUT
OUTPUT
Features
• EMI Filtering and ESD Protection
• Integration of 50 Discretes
• Provides Protection for IEC61000−4−2 (Level 4)
♦ 8.0 kV (Contact)
R
= 100 W
= 28 pF
I/O
C
input
• Flip−Chip Package
MARKING DIAGRAM
• Moisture Sensitivity Level 1
• ESD Rating: Machine Model = C; Human Body Model = 3B
• Pb−Free Package is Available*
NUF9002
AYWWG
G
A1
Flip−Chip
CASE 499G
Benefits
• Reduces EMI/RFI Emissions on a Data Line
• Integrated Solution Offers Cost and Space Savings
• Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
NUF9002 = Specific Device Code
A
Y
= Assembly Location
= Year
WW
G
= Work Week
= Pb−Free Package
• Integrated Solution Improves System Reliability
(Note: Microdot may be in either location)
PIN CONFIGURATION
Applications
(Ball Side)
• LCD for Cell Phones and PDAs
• Computers and Printers
• Communication Systems
• MP3 Players
1
2
3
4
5
O1
O2
O3
O4
O5
E
D
C
B
A
O6
GND
IN6
IN1
O7
GND
IN7
IN2
O8
GND
IN8
IN3
O9
GND
IN9
IN4
O10
GND
IN10
IN5
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Rating
Symbol
Value
Unit
ESD Discharge
IEC61000−4−2
Contact Discharge
V
PP
8.0
kV
Steady−State Power per Resistor
Steady−State Power per Package
Operating Temperature Range
Storage Temperature Range
Junction Temperature
P
R
100
200
mW
mW
°C
P
T
T
OP
−40 to +85
−55 to +150
+125
T
STG
°C
ORDERING INFORMATION
T
J
°C
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NUF9002FCT1
Flip−Chip 3000 Tape & Reel
NUF9002FCT1G
Flip−Chip 3000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 1
NUF9002FC/D