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JAN1N3821 PDF预览

JAN1N3821

更新时间: 2024-01-04 14:08:40
品牌 Logo 应用领域
美高森美 - MICROSEMI 二极管齐纳二极管测试
页数 文件大小 规格书
3页 275K
描述
SILICON 1 WATT ZENER DIODES

JAN1N3821 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.72二极管类型:ZENER DIODE
认证状态:Not QualifiedBase Number Matches:1

JAN1N3821 数据手册

 浏览型号JAN1N3821的Datasheet PDF文件第2页浏览型号JAN1N3821的Datasheet PDF文件第3页 
1N3821 thru 1N3830A  
1 Watt Metal Case Zener Diodes  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This well established zener diode series for the 1N3821 thru 1N3830A  
JEDEC registration in the glass hermetic sealed DO-13 package provides a  
low voltage selection for 3.3 to 7.5 volts. It is also well suited for high-  
reliability applications where it is available in JAN, JANTX, and JANTXV  
military qualifications. Higher voltages are also available in the 1N3016  
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate  
data sheet). Microsemi also offers numerous other Zener diode products  
for a variety of other packages including surface mount.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Zener Voltage Range: 3.3 V to 7.5 V  
Hermetically sealed DO-13 metal package  
Internally solder-bonded construction.  
Also available in JAN, JANTX, JANTXV  
qualifications per MIL-PRF19500/115 by adding the  
JAN, JANTX, or JANTXV prefixes to part numbers  
for desired level of screening, e.g. JANTX1N3821,  
JANTXV1N3051A, etc.  
Regulates voltage over a broad operating current  
and temperature range  
Low voltage selection from 3.3 to 7.5 V  
Tight voltage tolerances available  
Low reverse (leakage) currents  
Nonsensitive to ESD  
Hermetically sealed metal package  
Inherently radiation hard as described in Microsemi  
Surface mount also available with 1N3821UR-1  
MicroNote 050  
thru 1N30330AUR-1 series on separate data sheet  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating Junction and Storage Temperatures:  
CASE: DO-13 (DO-202AA), welded, hermetically  
-65oC to +175oC  
sealed metal and glass  
THERMAL RESISTANCE: 50oC/W* junction to lead  
at 0.375 inches (10 mm) from body or 110 oC/W  
junction to ambient when leads are mounted on FR4  
PC board with 4 mm2 copper pads (1 oz) and track  
width 1 mm, length 25 mm  
FINISH: All external surfaces are Tin-Lead (Pb/Sn)  
plated and solderable per MIL-STD-750 method  
2026  
POLARITY: Cathode connected case.  
WEIGHT: 1.4 grams.  
DC Power Dissipation*: 1 Watt at TL < +125oC 3/8”  
(10 mm) from body or 1.0 Watts at TL < +65oC when  
mounted on FR4 PC board as described for thermal  
resistance above (also see Fig 1)  
Tape & Reel option: Standard per EIA-296 (add  
“TR” suffix to part number)  
See package dimensions on last page  
Forward Voltage @ 200 mA: 1.5 Volts.  
Solder Temperatures: 260 o C for 10 s (maximum)  
o
* For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20 C/W  
when mounting DO-13 metal case directly on heat sink.  
Copyright 2003  
Microsemi  
Scottsdale Division  
Page 1  
11-06-2003 REV A  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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