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A2F060M3D-FGG256I PDF预览

A2F060M3D-FGG256I

更新时间: 2024-02-14 05:13:13
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
192页 11779K
描述
SmartFusion Customizable System-on-Chip (cSoC)

A2F060M3D-FGG256I 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.76
JESD-609代码:e1湿度敏感等级:3
峰值回流温度(摄氏度):250可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)处于峰值回流温度下的最长时间:30
Base Number Matches:1

A2F060M3D-FGG256I 数据手册

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Revision 10  
SmartFusion Customizable System-on-Chip (cSoC)  
Programmable Embedded FIFO Control Logic  
Microcontroller Subsystem (MSS)  
Secure ISP with 128-Bit AES via JTAG  
FlashLock® to Secure FPGA Contents  
Five Clock Conditioning Circuits (CCCs) with up to 2  
Integrated Analog PLLs  
Hard 100 MHz 32-Bit ARM® Cortex™-M3  
1.25 DMIPS/MHz Throughput from Zero Wait State  
Memory  
Memory Protection Unit (MPU)  
Phase Shift, Multiply/Divide, and Delay Capabilities  
Frequency: Input 1.5–350 MHz, Output 0.75 to  
350 MHz  
Single Cycle Multiplication, Hardware Divide  
JTAG Debug (4 wires), Serial Wire Debug (SWD, 2  
wires), and Single Wire Viewer (SWV) Interfaces  
Internal Memory  
Programmable Analog  
Embedded Nonvolatile Flash Memory (eNVM), 128  
Kbytes to 512 Kbytes  
Analog Front-End (AFE)  
Up to Three 12-Bit SAR ADCs  
Embedded High-Speed SRAM (eSRAM), 16 Kbytes  
to 64 Kbytes, Implemented in 2 Physical Blocks to  
500 Ksps in 12-Bit Mode  
550 Ksps in 10-Bit Mode  
600 Ksps in 8-Bit Mode  
Enable Simultaneous Access from  
Masters  
2 Different  
Multi-Layer AHB Communications Matrix  
Internal 2.56  
Reference  
V
Reference or Optional External  
Provides up to 16 Gbps of On-Chip Memory  
Bandwidth,1 Allowing Multi-Master Schemes  
One First-Order  DAC (sigma-delta) per ADC  
8-Bit, 16-Bit, or 24-Bit 500 Ksps Update Rate  
10/100 Ethernet MAC with RMII Interface2  
Programmable External Memory Controller, Which  
Supports:  
Up to 5 High-Performance Analog Signal Conditioning  
Blocks (SCB) per Device, Each Including:  
Asynchronous Memories  
NOR Flash, SRAM, PSRAM  
Synchronous SRAMs  
Two High-Voltage Bipolar Voltage Monitors (with 4  
input ranges from ±2.5 V to –11.5/+14 V) with 1%  
Accuracy  
High Gain Current Monitor, Differential Gain = 50, up  
to 14 V Common Mode  
Two I2C Peripherals  
Two 16550 Compatible UARTs  
Two SPI Peripherals  
Two 32-Bit Timers  
32-Bit Watchdog Timer  
8-Channel DMA Controller to Offload the Cortex-M3  
from Data Transactions  
Clock Sources  
Temperature Monitor (Resolution = ¼°C in 12-Bit  
Mode; Accurate from –55°C to 150°C)  
Up to Ten High-Speed Voltage Comparators  
(tpd = 15 ns)  
Analog Compute Engine (ACE)  
Offloads Cortex-M3–Based MSS from Analog  
Initialization and Processing of ADC, DAC, and SCBs  
Sample Sequence Engine for ADC and DAC Parameter  
Set-Up  
32 KHz to 20 MHz Main Oscillator  
Battery-Backed 32 KHz Low Power Oscillator with  
Real-Time Counter (RTC)  
100 MHz Embedded RC Oscillator; 1% Accurate  
Embedded Analog PLL with 4 Output Phases (0, 90,  
180, 270)  
Post-Processing Engine for Functions such as Low-  
Pass Filtering and Linear Transformation  
Easily Configured via GUI in Libero® System-on-Chip  
(SoC) Software  
High-Performance FPGA  
I/Os and Operating Voltage  
Based on proven ProASIC®3 FPGA Fabric  
Low Power, Firm-Error Immune 130-nm, 7-Layer Metal,  
Flash-Based CMOS Process  
FPGA I/Os  
LVDS, PCI, PCI-X, up to 24 mA IOH/IOL  
Up to 350 MHz  
Nonvolatile, Instant On, Retains Program When  
Powered Off  
MSS I/Os  
350 MHz System Performance  
Embedded SRAMs and FIFOs  
Schmitt Trigger, up to 6 mA IOH, 8 mA IOL  
Up to 180 MHz  
Variable Aspect Ratio 4,608-Bit SRAM Blocks  
x1, x2, x4, x9, and x18 Organizations  
True Dual-Port SRAM (excluding x18)  
Single 3.3 V Power Supply with On-Chip 1.5 V Regulator  
External 1.5 V Is Allowed by Bypassing Regulator  
(digital VCC = 1.5 V for FPGA and MSS, analog VCC =  
3.3 V and 1.5 V)  
1 Theoretical maximum  
2 A2F200 and larger devices  
January 2013  
I
© 2013 Microsemi Corporation  

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