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27LV256-25I/SO PDF预览

27LV256-25I/SO

更新时间: 2024-01-24 16:24:02
品牌 Logo 应用领域
美国微芯 - MICROCHIP 可编程只读存储器电动程控只读存储器
页数 文件大小 规格书
12页 68K
描述
32K X 8 OTPROM, 250 ns, PDSO28, 0.300 INCH, PLASTIC, SOIC-28

27LV256-25I/SO 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:8 X 13.40 MM, PLASTIC, VSOP-28针数:28
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.91
Is Samacsys:N最长访问时间:250 ns
其他特性:DATA RETENTION >200 YEARSI/O 类型:COMMON
JESD-30 代码:R-PDSO-G28JESD-609代码:e0
长度:11.8 mm内存密度:262144 bit
内存集成电路类型:OTP ROM内存宽度:8
功能数量:1端子数量:28
字数:32768 words字数代码:32000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:32KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP28,.53,22
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3/5 V编程电压:13 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.0001 A子类别:OTP ROMs
最大压摆率:0.025 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

27LV256-25I/SO 数据手册

 浏览型号27LV256-25I/SO的Datasheet PDF文件第2页浏览型号27LV256-25I/SO的Datasheet PDF文件第3页浏览型号27LV256-25I/SO的Datasheet PDF文件第4页浏览型号27LV256-25I/SO的Datasheet PDF文件第5页浏览型号27LV256-25I/SO的Datasheet PDF文件第6页浏览型号27LV256-25I/SO的Datasheet PDF文件第7页 
27LV256  
256K (32K x 8) Low-Voltage CMOS EPROM  
FEATURES  
PACKAGE TYPES  
PDIP  
• Wide voltage range 3.0V to 5.5V  
• High speed performance  
VPP • 1  
28 VCC  
27 A14  
26 A13  
25 A8  
24 A9  
23 A11  
22 OE  
21 A10  
20 CE  
19 O7  
18 O6  
17 O5  
16 O4  
15 O3  
A12  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
O0  
O1  
O2  
2
3
4
- 200 ns access time available at 3.0V  
• CMOS Technology for low power consumption  
- 8 mA Active current at 3.0V  
5
6
7
8
- 20 mA Active current at 5.5V  
9
10  
11  
12  
13  
- 100 µA Standby current  
• Factory programming available  
• Auto-insertion-compatible plastic packages  
• Auto ID aids automated programming  
• Separate chip enable and output enable controls  
• High speed “Express” programming algorithm  
• Organized 32K x 8: JEDEC standard pinouts  
- 28-pin Dual-in-line package  
VSS 14  
PLCC  
5
29  
A6  
A8  
6
28  
A5  
A4  
A3  
A2  
A1  
A0  
NC  
O0  
A9  
7
27  
A11  
- 32-pin PLCC package  
8
26  
25  
24  
23  
22  
21  
NC  
OE  
A10  
CE  
O7  
O6  
9
- 28-pin SOIC package  
10  
11  
12  
13  
- 28-pin VSOP package  
- Tape and reel  
• Data Retention > 200 years  
• Available for the following temperature ranges:  
- Commercial:  
- Industrial:  
0˚C to +70˚C  
SOIC  
-40˚C to +85˚C  
VPP  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
A14  
A13  
A8  
2
3
DESCRIPTION  
A6  
4
A5  
5
A9  
The Microchip Technology Inc. 27LV256 is a low volt-  
age (3.0 volt) CMOS EPROM designed for battery  
powered applications. The device is organized as a  
32K x 8 (32K-Byte) non-volatile memory product. The  
27LV256 consumes only 8 mA maximum of active cur-  
rent during a 3.0 volt read operation therefore improv-  
ing battery performance. This device is designed for  
very low voltage applications where conventional 5.0  
volt only EPROMS can not be used. Accessing individ-  
ual bytes from an address transition or from power-up  
(chip enable pin going low) is accomplished in less than  
200 ns at 3.0V. This device allows systems designers  
the ability to use low voltage non-volatile memory with  
today’s' low voltage microprocessors and peripherals  
in battery powered applications.  
A4  
6
A11  
OE  
A10  
CE  
O7  
A3  
7
A2  
8
A1  
9
A0  
10  
11  
12  
13  
14  
O0  
O1  
O2  
VSS  
O6  
O5  
O4  
O3  
VSOP  
OE  
A11  
A9  
A8  
A13  
A14  
22  
23  
24  
25  
26  
27  
A10  
CE  
O7  
O6  
O5  
O4  
O3  
VSS  
O2  
O1  
O0  
A0  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
28  
1
VCC  
VPP  
A complete family of packages is offered to provide the  
most flexibility in applications. For surface mount appli-  
cations, PLCC, VSOP or SOIC packaging is available.  
Tape and reel packaging is also available for PLCC or  
SOIC packages.  
2
3
4
5
6
7
A12  
A7  
A6  
A5  
A4  
A3  
A1  
A2  
8
1996 Microchip Technology Inc.  
DS11020F-page 1  
This document was created with FrameMaker 4 0 4  

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