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ILC-3F-2.14G PDF预览

ILC-3F-2.14G

更新时间: 2024-01-31 21:23:42
品牌 Logo 应用领域
MERRIMAC 射频和微波射频分光器射频合路器微波分光器微波合路器
页数 文件大小 规格书
5页 143K
描述
IN-LINE COUPLERS

ILC-3F-2.14G 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:SURFACE MOUNT PACKAGE-6Reach Compliance Code:unknown
风险等级:5.68构造:COMPONENT
最大输入功率 (CW):50 dBm最大插入损耗:0.35 dB
最大工作频率:2240 MHz最小工作频率:2040 MHz
最高工作温度:85 °C最低工作温度:-55 °C
射频/微波设备类型:SPLITTER AND COMBINER最大电压驻波比:1.25
Base Number Matches:1

ILC-3F-2.14G 数据手册

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ILC-3F-2.14G  
IN-LINE COUPLERS  
REV: 002, 06/28/02  
• 2.04 - 2.24 GHz  
• LOW LOSS  
• LOW VSWR  
• HIGH ISOLATION  
• SURFACE MOUNT  
TECHNICAL DESCRIPTION / APPLICATION  
MULTI-MIX® F SERIES IN-LINE COUPLERS  
The Multi-Mix® ILC-F series provides a power divider and combiner function with low insertion loss,  
high isolation, and high power handling in a small outline. The ILC series are composed of serial con-  
nected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is  
maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of  
the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do  
not. Accurate phase and amplitude balance make them ideal for applications involving power  
amplifiers, signal distribution and processing.  
ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process  
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical  
performance that is superior to conventional adhesive bonding techniques.  
The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless  
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are  
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground  
plane provides excellent EM shielding.  
AVAILABLE ON  
Additional benefits include:  
TAPE & REEL  
• Cost effective for commercial wireless applications  
• Operating temperature range –55°C to +85°C.  
• Can be integrated with other Multi-Mix® components in a multi-functi
RELIABILITY  
The product family has passed environmental screening including Thermal shock, Burn-in,  
Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and  
Thermal Cycling Life Test (>1000 cycles).  
THE MULTI-MIX® PROCESS  
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion  
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous  
monolithic structure with superior performance at microwave and millimeter wave frequencies. The  
bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and  
plated-through vias to form a SMD module that requires no additional packaging and is suitable for  
automated assembly.  
THE MULTI-MIX MICROTECHNOLOGY® GROUP IS ISO-9001 REGISTERED  
U.S. patent 6,099,677 and other patents pending.  
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006  
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com  

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