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DS3164+ PDF预览

DS3164+

更新时间: 2024-01-20 17:18:38
品牌 Logo 应用领域
美信 - MAXIM ATM异步传输模式电信电信集成电路
页数 文件大小 规格书
384页 3442K
描述
ATM Network Interface, 1-Func, PBGA400, 27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400

DS3164+ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400针数:400
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.8
应用程序:ATM;SDH;SONETJESD-30 代码:S-PBGA-B400
长度:27 mm湿度敏感等级:3
功能数量:1端子数量:400
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA400,20X20,50封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:2.54 mm子类别:ATM/SONET/SDH ICs
最大压摆率:0.468 mA标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:ATM/SONET/SDH NETWORK INTERFACE
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:27 mm
Base Number Matches:1

DS3164+ 数据手册

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DS3161/DS3162/DS3163/DS3164  
Single/Dual/Triple/Quad  
ATM/Packet PHYs for DS3/E3/STS-1  
www.maxim-ic.com  
FUNCTIONAL DIAGRAM  
GENERAL DESCRIPTION  
The DS3161, DS3162, DS3163, and DS3164  
(DS316x)  
integrate ATM  
cell/HDLC  
packet  
processor(s) with DS3/E3 framer(s) to map/demap  
ATM cells or packets into as many as four DS3/E3  
digital lines with DS3-framed, E3-framed, or clear-  
channel data streams on per-port basis.  
POS-PHY  
or  
DS3/E3  
FRAMER/  
CELL/  
PACKET  
DS3/E3 LINE  
INTERFACE  
UTOPIA  
FORMATTER  
PROCESSOR  
APPLICATIONS  
Access Concentrators Multiservice Access  
Platform (MSAP)  
SONET/SDH ADM  
SONET/SDH Muxes  
PBXs  
DS316x  
Multiservice Protocol  
Platform (MSPP)  
FEATURES  
Digital Cross Connect ATM and Frame Relay  
Test Equipment  
Equipment  
Single (DS3161), Dual (DS3162), Triple  
(DS3163), or Quad (DS3164) ATM/Packet PHYs  
for DS3, E3, and Clear-Channel 52Mbps (CC52)  
Routers and Switches PDH Multiplexer/  
Demultiplexer  
Integrated Access  
Pin Compatible for Ease of Port Density  
Device (IAD)  
Migration in the Same PC Board Platform  
ORDERING INFORMATION  
Each Port Independently Configurable  
PART  
TEMP RANGE PIN-PACKAGE  
Universal PHYs Map ATM Cells and/or HDLC  
400 TE-PBGA (27mm x  
Packets into DS3 or E3 Data Streams  
DS3161  
0°C to +70°C  
-40°C to +85°C  
0°C to +70°C  
-40°C to +85°C  
0°C to +70°C  
-40°C to +85°C  
0°C to +70°C  
-40°C to +85°C  
27mm, 1.27mm pitch)  
UTOPIA L2/L3 or POS-PHY™ L2/L3 or SPI-3  
Interface with 8-, 16-, or 32-Bit Bus Width  
400 TE-PBGA (27mm x  
DS3161N  
DS3162  
27mm, 1.27mm pitch)  
66MHz UTOPIA L3 and POS-PHY L3 Clock  
52MHz UTOPIA L2 and POS-PHY L2 Clock  
400 TE-PBGA (27mm x  
27mm, 1.27mm pitch)  
400 TE-PBGA (27mm x  
DS3162N  
DS3163  
Ports Independently Configurable for Cell or  
27mm, 1.27mm pitch)  
Packet Traffic in POS-PHY Bus Modes  
400 TE-PBGA (27mm x  
27mm, 1.27mm pitch)  
Direct, PLCP, DSS, and Clear-Channel Cell  
Mapping  
400 TE-PBGA (27mm x  
DS3163N  
DS3164  
27mm, 1.27mm pitch)  
Direct and Clear-Channel Packet Mapping  
400 TE-PBGA (27mm x  
27mm, 1.27mm pitch)  
On-Chip DS3 (M23 or C-Bit) and E3 (G.751 or  
G.832) Framer(s)  
400 TE-PBGA (27mm x  
DS3164N  
27mm, 1.27mm pitch)  
Ports Independently Configurable for DS3, E3  
(Full or Subrate) or Arbitrary Framing Protocols  
Up to 52Mbps  
Programmable (Externally Controlled or  
Internally Finite State Machine Controlled)  
Subrate DS3/E3  
Note: Add the “+” suffix for the lead-free package option.  
POS-PHY and POS-PHY Level 3 are trademarks of PMC-Sierra, Inc.  
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device  
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.  
1
REV: 113006  

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