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10TPB330M PDF预览

10TPB330M

更新时间: 2024-01-16 14:49:17
品牌 Logo 应用领域
英特矽尔 - INTERSIL 电源电路电容器PC
页数 文件大小 规格书
28页 1952K
描述
Dual 15A/Single 30A Step-Down Power Module

10TPB330M 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:, 2917
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8532.21.00.50风险等级:5.75
Is Samacsys:N其他特性:RIPPLE CURRENT MEASURED AT 100KHZ TO 500 KHZ
电容:330 µF电容器类型:TANTALUM CAPACITOR
介电材料:TANTALUM (SOLID POLYMER)ESR:35 m Ω
高度:3.8 mmJESD-609代码:e4
漏电流:0.33 mA长度:7.3 mm
安装特点:SURFACE MOUNT负容差:20%
端子数量:2最高工作温度:105 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:TR
极性:POLARIZED正容差:20%
额定(直流)电压(URdc):10 V纹波电流:3000 mA
尺寸代码:2917表面贴装:YES
Delta切线:0.1端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形状:J BEND宽度:4.3 mm
Base Number Matches:1

10TPB330M 数据手册

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Dual 15A/Single 30A Step-Down Power Module  
ISL8225M  
Features  
• Fully-encapsulated dual step-down switching power supply  
• Up to 100W output from a 17mm square PCB footprint  
• Dual 15A or single 30A output  
The ISL8225M is a fully-encapsulated step-down switching  
power supply that can deliver up to 100W output power from a  
small 17mm square PCB footprint. The two 15A outputs may  
be used independently or combined to deliver a single 30A  
output. Designing a high-performance board-mounted power  
supply has never been simpler -- only a few external  
components are needed to create a very dense and reliable  
power solution.  
• Up to 95% conversion efficiency  
• 4.5V to 20V input voltage range  
• 0.6V to 6V output voltage range  
Automatic current sharing and phase interleaving allow up to  
six modules to be paralleled for 180A output capability. 1.5%  
output voltage accuracy, differential remote voltage sensing  
and fast transient response create a very high-performance  
power system. Built-in output over-voltage, over-current and  
over-temperature protection enhance system reliability.  
• 1.5% output voltage accuracy with differential remote  
sensing  
• Up to six modules may be paralleled to support 180A output  
current  
• Output over-voltage, over-current and over-temperature  
protection  
The ISL8225M is available in a thermally-enhanced QFN  
package. Excellent efficiency and low thermal resistance  
permit full power operation without heat sinks or fans. In  
addition, the QFN package with external leads permits easy  
probing and visual solder inspection.  
• Full power operation without heat sinks or fans  
• QFN package with exposed leads permits easy probing and  
visual solder inspection  
Related Resources  
• See AN1789 “ISL8225MEVAL2Z 6-Phase, 90A Evaluation  
Board Setup Procedure”  
Applications  
• Computing, networking and telecom infrastructure  
equipment  
• See AN1790 “ISL8225MEVAL3Z 30A, Single Output  
Evaluation Board Setup Procedure”  
• Industrial and medical equipment  
• General purpose point-of-load (POL) power  
• See AN1793, “ISL8225MEVAL4Z Dual 15A/Optional 30A  
Cascadable Evaluation Board”  
• See ISL8225M 110A Thermal Performance Video  
4.5V TO 20V  
4x22µF  
1.2V@30A  
V
V
VIN1  
VIN2  
VOUT1  
VOUT2  
IN  
OUT  
1k  
VSEN1+  
R
SET  
1kΩ  
EN/FF1  
EN/FF2  
VSEN2-  
5x100µF  
7.5mm  
OFF ON  
VSEN1-  
VMON1  
VMON2  
COMP1  
COMP2  
ISL8225M  
VCC  
4.7µF  
470pF  
NOTE: ALL PINS NOT SHOWN ARE FLOATING.  
FIGURE 1. COMPLETE 30A STEP-DOWN POWER SUPPLY  
FIGURE 2. SMALL FOOTPRINT WITH HIGH POWER DENSITY  
December 3, 2012  
FN7822.0  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved  
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.  
All other trademarks mentioned are the property of their respective owners.  
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