Datasheet > 28F800F3

28F800F3

更新时间： 2022-11-27 09:03:39

品牌	Logo	应用领域
英特尔 - INTEL		闪存
页数	文件大小	规格书
47页	274K
描述
FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT

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28F800F3 数据手册

PRODUCT PREVIEW

FAST BOOT BLOCK

FLASH MEMORY FAMILY

8 AND 16 MBIT

28F800F3, 28F160F3

Includes Extended and Automotive Temperature Specifications

High Performance

Supports Code Plus Data Storage

Optimized for Flash Data Integrator

(FDI) Software

54 MHz Effective Zero Wait-State

Performance

Synchronous Burst-Mode Reads

Asynchronous Page-Mode Reads

Fast Program Suspend Capability

Fast Erase Suspend Capability

SmartVoltage Technology

Flexible Blocking Architecture

Eight 4-Kword Blocks for Data

32-Kword Main Blocks for Code

Top or Bottom Configurations

Available

2.7 V−3.6 V Read and Write

Operations for Low Power Designs

12 V V_PPFast Factory Programming

Flexible I/O Voltage

1.65 V I/O Reduces Overall System

Power Consumption

5 V-Safe I/O Enables Interfacing to

5 V Devices

Extended Cycling Capability

Minimum 10,000 Block Erase Cycles

Guaranteed

Low Power Consumption

Enhanced Data Protection

Absolute Write Protection with

V_PP= GND

Automatic Power Savings Mode

Decreases Power Consumption

Automated Program and Block Erase

Algorithms

Block Locking

Block Erase/Program Lockout

during Power Transitions

Command User Interface for

Automation

Density Upgrade Path

8- and 16-Mbit

Status Register for System

Feedback

Manufactured on ETOX™ V Flash

Technology

Industry-Standard Packaging

56-Lead SSOP

µBGA* CSP

Intel’s Fast Boot Block memory family renders high performance asynchronous page-mode and synchronous

burst reads making it an ideal memory solution for burst CPUs. Combining high read performance with the

intrinsic non-volatility of flash memory, this flash memory family eliminates the traditional redundant memory

paradigm of shadowing code from a slow nonvolatile storage source to a faster execution memory for

improved system performance. Therefore, it reduces the total memory requirement which helps increase

reliability and reduce overall system power consumption and cost.

This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. They are available

in industry-standard packages: the µBGA* CSP, ideal for board-constrained applications, and the rugged

56-lead SSOP.

May 1998

Order Number: 290644-001

12 3 4 5 6 7...47

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