Datasheet > 28F008C3

28F008C3

更新时间： 2022-11-25 16:12:58

品牌	Logo	应用领域
英特尔 - INTEL		闪存
页数	文件大小	规格书
59页	380K
描述
3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

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28F008C3 数据手册

PRODUCT PREVIEW

3 VOLT ADVANCED+ BOOT BLOCK

8-, 16-, 32-MBIT

FLASH MEMORY FAMILY

28F008C3, 28F016C3, 28F032C3

28F800C3, 28F160C3, 28F320C3

Flexible SmartVoltage Technology

2.7 V–3.6 V Read/Program/Erase

Easy-12 V

Faster Production Programming

2.7 V or 1.65 V I/O Option Reduces

Overall System Power

12 V for Fast Production

Programming

No Additional System Logic

128-bit Protection Register

64-bit Unique Device Identifier

64-bit User Programmable OTP

Cells

High Performance

2.7 V–3.6 V: 90 ns Max Access Time

3.0 V–3.6 V: 80 ns Max Access Time

Extended Cycling Capability

Minimum 100,000 Block Erase

Cycles

Optimized Architecture for Code Plus

Data Storage

Flash Data Integrator Software

Flash Memory Manager

Eight 8-Kbyte Blocks,

Top or Bottom Locations

Up to Sixty-Three 64-KB Blocks

Fast Program Suspend Capability

Fast Erase Suspend Capability

System Interrupt Manager

Supports Parameter Storage,

Streaming Data (e.g., voice)

Automated Word/Byte Program and

Block Erase

Flexible Block Locking

Lock/Unlock Any Block

Full Protection on Power-Up

WP# Pin for Hardware Block

Protection

Command User Interface

Status Registers

SRAM-Compatible Write Interface

V_PP= GND Option

V_CCLockout Voltage

Cross-Compatible Command Support

Intel Basic Command Set

Common Flash Interface

Low Power Consumption

9 mA Typical Read Power

10 µA Typical Standby Power with

Automatic Power Savings Feature

x 16 for High Performance

48-Ball µBGA* Package

48-Lead TSOP Package

Extended Temperature Operation

–40 °C to +85 °C

x 8 I/O for Space Savings

48-Ball µBGA* Package

40-Lead TSOP Package

0.25 µ ETOX™ VI Flash Technology

The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a

feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage

capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking

allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data

Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on

the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,

and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing

Intel’s WWW page: http://www.intel.com/design/flcomp.

May 1998

Order Number: 290645-001

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