是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.38 |
Is Samacsys: | N | JESD-30 代码: | S-PBGA-B780 |
长度: | 29 mm | 输入次数: | 360 |
逻辑单元数量: | 320000 | 输出次数: | 360 |
端子数量: | 780 | 最高工作温度: | 100 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | BGA | 封装等效代码: | BGA780,28X28,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 0.9 V |
可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 3.35 mm | 子类别: | Field Programmable Gate Arrays |
最大供电电压: | 0.93 V | 最小供电电压: | 0.87 V |
标称供电电压: | 0.9 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 29 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
10AX032E3F29I2SG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBG |
获取价格 |
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10AX032E4F29I3LG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA780, 29 X 29 MM, ROHS COMPLIANT, FBG |
获取价格 |
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10AX032H2F34I2SG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB |
获取价格 |
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10AX032H3F34E2SG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB |
获取价格 |
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10AX032H4F34E3SG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB |
获取价格 |
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10AX032H4F35I3SG | INTEL | Field Programmable Gate Array, 320000-Cell, CMOS, PBGA1152, 35 X 35 MM, ROHS COMPLIANT, FB |
获取价格 |