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2N7604U2 PDF预览

2N7604U2

更新时间: 2024-02-07 16:51:36
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
9页 193K
描述
Power Field-Effect Transistor, 56A I(D), 60V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-2, 3 PIN

2N7604U2 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Transferred包装说明:CHIP CARRIER, R-CBCC-N3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.84
雪崩能效等级(Eas):402 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):56 A最大漏极电流 (ID):56 A
最大漏源导通电阻:0.012 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CBCC-N3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):250 W
最大脉冲漏极电流 (IDM):224 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:TIN LEAD端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

2N7604U2 数据手册

 浏览型号2N7604U2的Datasheet PDF文件第2页浏览型号2N7604U2的Datasheet PDF文件第3页浏览型号2N7604U2的Datasheet PDF文件第4页浏览型号2N7604U2的Datasheet PDF文件第5页浏览型号2N7604U2的Datasheet PDF文件第6页浏览型号2N7604U2的Datasheet PDF文件第7页 
PRELIMINARY  
PD-97177B  
2N7604U2  
RADIATION HARDENED  
IRHLNA77064  
LOGIC LEVEL POWER MOSFET  
SURFACE MOUNT (SMD-2)  
60V, N-CHANNEL  
TECHNOLOGY  
™
Product Summary  
Part Number  
IRHLNA77064  
IRHLNA73064  
Radiation Level RDS(on)  
ID  
56A*  
56A*  
100K Rads (Si)  
300K Rads (Si)  
0.012Ω  
0.012Ω  
SMD-2  
Features:  
International Rectifier’s R7TM Logic Level Power  
MOSFETs provide simple solution to interfacing CMOS  
and TTL control circuits to power devices in space and  
other radiation environments. The threshold voltage  
remains within acceptable operating limits over the  
full operating temperature and post radiation. This is  
achieved while maintaining single event gate rupture  
and single event burnout immunity.  
n
n
n
n
n
n
n
n
n
n
5V CMOS and TTL Compatible  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
These devices are used in applications such as current  
boost low signal source in PWM, voltage comparator  
and operational amplifiers.  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@V  
@V  
= 4.5V,T = 25°C  
Continuous Drain Current  
56*  
56*  
D
D
GS  
GS  
C
A
I
= 4.5V,T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
224  
DM  
@ T = 25°C  
P
D
250  
W
W/°C  
V
C
2.0  
V
±10  
GS  
E
402  
mJ  
A
AS  
I
56  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
25  
mJ  
V/ns  
AR  
dv/dt  
6.9  
T
-55 to 150  
J
°C  
g
T
Storage Temperature Range  
Pckg. Mounting Surface Temp.  
Weight  
STG  
300 (for 5s)  
3.3 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
03/01/11  

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