Datasheet > BGA-320P-M06

BGA-320P-M06

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
富士通 - FUJITSU		栅
页数	文件大小	规格书
1页	34K
描述
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC

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BGA-320P-M06 数据手册

FUJITSU SEMICONDUCTOR

DATA SHEET

PLASTIC BALL GRID ARRAY PACKAGE

320 PIN PLASTIC

BGA-320P-M06

320-pin plastic PBGA

Lead pitch

1.27 mm

27.00 mm × 27.00 mm

Ball

Package width ×

package length

Lead shape

Sealing method

Mounting height

Weight

Plastic mold

2.46 mm Max

2.90 g

(BGA-320P-M06)

320-pin plastic PBGA

(BGA-320P-M06)

27.00(1.063)

24.13(.950)

24.00±0.10(.945±.004)

1.44

(.057)

0.635

(.025)

1.27

(.050)

1.27

(.050)

27.00

(1.063)

24.13

(.950)

24.00±0.10

(.945±.004)

0.635

(.025)

INDEX

1.44

(.057)

0.20(.008) (4X)

Y W V

U T R P N M L K J H G F E D C B A

ø0.75±0.15(.030±.006)

ø0.30(.012)

ø0.15(.006)

C A

2.46(.097)

MAX.

0.15(.006)

1.66±0.10

(.065±.004)

0.35(.014)

MIN.

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

2006 FUJITSU LIMITED BGA320006S-c-2-1

The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.

0612

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