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I.MX27

更新时间: 2022-12-18 00:38:02
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飞思卡尔 - FREESCALE /
页数 文件大小 规格书
148页 2103K
描述
Multimedia Applications Processor

I.MX27 数据手册

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Freescale Semiconductor  
Data Sheet, Technical Data  
Document Number: MCIMX27EC  
Rev. 1.5, 12/2009  
i.MX27 and i.MX27L  
Package Information  
Plastic Package  
Case 1816-01  
i.MX27 and i.MX27L  
Data Sheet  
Multimedia Applications  
Processor  
(MAPBGA–404)  
Case 1931-04  
(MAPBGA-473)  
Ordering Information  
See Table 1 on page 4 for ordering information.  
Contents  
1 Introduction  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . .  
2
3
4
The i.MX27 and i.MX27L (MCIMX27/MX27L)  
Multimedia Applications Processors represents the next  
step in low-power, high-performance application  
processors. Unless otherwise specified, the material in  
this data sheet is applicable to both the i.MX27 and  
i.MX27L processors and referred to singularly  
throughout this document as i.MX27.  
2. Functional Description and Application Information . . . . 4  
2.1. ARM926 Microprocessor Core Platform . . . . . . . .  
2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . .  
2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . .  
4
5
9
3. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35  
3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 36  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . 40  
4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40  
4.2. Module-Level Electrical Specifications . . . . . . . . 43  
4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54  
5. Package Information and Pinout . . . . . . . . . . . . . . . . 105  
5.1. Full Package Outline Drawing (17 mm × 17 mm) 105  
5.2. Pin Assignments (17 mm × 17 mm) . . . . . . . . . 106  
5.3. Full Package Outline Drawing (19 mm × 19 mm) 125  
5.4. Pin Assignments (19 mm × 19 mm) . . . . . . . . . 126  
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 147  
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147  
The i.MX27L does not include the following features:  
ATA-6 HDD Interface, Memory Stick Pro, VPU:  
MPEG-4/ H.263/H.264 HW encoder/decoder, and  
eMMA (PrP processing, CSC, deblock, dering).  
Based on an ARM926EJ-S™ microprocessor core, the  
i.MX27/27L processor provides the performance with  
low-power consumption required by modern digital  
devices such as the following:  
Feature-rich cellular phones  
Portable media players and mobile gaming  
machines  
Personal digital assistants (PDAs) and wireless  
PDAs  
This document contains information on a new product. Specifications and information herein  
are subject to change without notice.  
© Freescale Semiconductor, Inc., 2007, 2009. All rights reserved.  

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