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FXLA2203UMX PDF预览

FXLA2203UMX

更新时间： 2024-02-26 08:15:45
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 电信电信集成电路
页数 文件大小 规格书
16页 777K
描述
RF and Baseband Circuit, 3.40 X 2.50 MM, 0.40 MM, PLASTIC, UMLP-24

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FXLA2203UMX 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Transferred零件包装代码：UMLP
包装说明：VQCCN,针数：24
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.63
JESD-30 代码：R-XQCC-N24JESD-609代码：e3
长度：3.4 mm湿度敏感等级：1
功能数量：1端子数量：24
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：UNSPECIFIED封装代码：VQCCN
封装形状：RECTANGULAR封装形式：CHIP CARRIER, VERY THIN PROFILE
峰值回流温度（摄氏度）：260座面最大高度：0.55 mm
表面贴装：YES电信集成电路类型：RF AND BASEBAND CIRCUIT
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：NO LEAD端子节距：0.4 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2.5 mmBase Number Matches：1

FXLA2203UMX 数据手册

 浏览型号FXLA2203UMX的Datasheet PDF文件第2页浏览型号FXLA2203UMX的Datasheet PDF文件第3页浏览型号FXLA2203UMX的Datasheet PDF文件第4页浏览型号FXLA2203UMX的Datasheet PDF文件第5页浏览型号FXLA2203UMX的Datasheet PDF文件第6页浏览型号FXLA2203UMX的Datasheet PDF文件第7页 
August 2012  
FXLA2203  
Dual-Mode, Dual-SIM-Card Level Translator  
Description  
Features  
The FXLA2203 allows either two hosts to  
simultaneously communicate with two Subscriber  
Identity Modules (SIM), or two User Identity Modules  
(UIM). Dual Mode refers to the mobile phones that are  
compatible with more than one form of data  
transmission or network (such as GSM, CDMA,  
WCDMA, TDSCDMA, or CDMA2000), resulting in a  
dual-baseband processor configuration. In a dual-mode  
application, the FXLA2203 host ports interface directly  
with the baseband processors (see Figure 9).  
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Easy-to-Use “Single Pin” SIM Card Swap Control  
Channel Swap Time: 130ns (Typical)  
Simultaneous Dual-Mode, Dual-SIM Communication  
Host Ports: 1.65V to 3.6V Voltage Translation  
Card Ports: 1.65V to 3.6V Voltage Translation  
Leverages the Presence of Existing PMIC LDOs  
ISO7816 Compliant  
The bi-directional I/O open-drain channel features auto-  
direction and internal 10KΩ pull-up resistors. RST and CLK  
provide unidirectional translation from host to card only.  
Power Switch RON: 0.5Ω (Typical)  
Supports Class B 3V SIM / UIM Cards  
Supports Class C: 1.8V SIM / UIM Cards  
Non-Preferential Host VCC Power-Up Sequencing  
Either host can swap SIM slots with the assertion of a  
single control pin: CH_Swap. The typical channel swap  
time is 130ns.  
Activation / Deactivation Timing Compliant  
per ISO7816-03  
The FXLA2203 does not contain internal Low Dropout  
Regulator (LDOs). Instead, the FXLA2203 architecture  
incorporates two low-RON internal power switches for  
routing existing PMIC (Power Management Integrated  
Circuit) LDOs to individual SIM slots. This reduces  
overall system power, leverages existing LDO system  
resources, and aligns with the philosophy that  
centralizing LDOs in the PMIC facilitates power  
management. Since the FXLA2203 does not block the  
LDO function to the SIM card, existing activation /  
deactivation timing transparency is maintained between  
Hosts, PMICs, and SIM cards.  
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Internal Pull up Resistors for Bi-Directional I/O Pin  
Outputs Switch to 3-State if Host VCC at GND  
Power-Off Protection  
Packaged in 24-Terminal UMLP (2.5mm x 3.5mm)  
Direction Control Not Needed  
Applications  
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Dual-Mode Dual-SIM Applications  
The device allows voltage translation from as high as  
3.6V to as low as 1.65V. Each port tracks its own port  
power supply.  
GSM, CDMA, WCDMA, TDSCDMA CDMA2000,  
3G Cellular Phones  
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Mobile TV: OMA BCAST  
Ordering Information  
Operating  
Temperature Range  
Packing  
Part Number  
Package  
Method  
24-Terminal, 2.5mm x 3.4mm Ultrathin Molded  
Tape and Reel  
FXLA2203UMX  
-40 to 85°C  
Leadless Package (UMLP), 0.4mm Pitch  
© 2010 Fairchild Semiconductor Corporation  
FXLA2203 • Rev. 1.0.5  
www.fairchildsemi.com  
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