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FXLA2203UMX PDF预览

FXLA2203UMX - FAIRCHILD SEMICONDUCTOR

电信电信集成电路
型号:
FXLA2203UMX
Datasheet下载:
下载Datasheet文件
产品描述:
RF and Baseband Circuit, 3.40 X 2.50 MM, 0.40 MM, PLASTIC, UMLP-24
应用标签:
电信电信集成电路
文档页数/大小:
16页 / 777K
品牌Logo:
品牌名称:
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]

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FXLA2203UMX

应用: 电信电信集成电路

文档: 16页 / 777K

品牌: FAIRCHILD

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  • 参数详情
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Brand Name
Fairchild Semiconductor
是否无铅
不含铅
是否Rohs认证
符合
生命周期
Transferred
零件包装代码
UMLP
包装说明
VQCCN,
针数
24
制造商包装代码
24LD,UMLP,QUAD, NON-JEDEC, 2.5 X 3.4MM BODY
Reach Compliance Code
compliant
ECCN代码
EAR99
HTS代码
8542.39.00.01
风险等级
5.63
JESD-30 代码
R-XQCC-N24
JESD-609代码
e3
长度
3.4 mm
湿度敏感等级
1
功能数量
1
端子数量
24
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
UNSPECIFIED
封装代码
VQCCN
封装形状
RECTANGULAR
封装形式
CHIP CARRIER, VERY THIN PROFILE
峰值回流温度(摄氏度)
260
座面最大高度
0.55 mm
表面贴装
YES
电信集成电路类型
RF AND BASEBAND CIRCUIT
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
NO LEAD
端子节距
0.4 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
2.5 mm
Base Number Matches
1
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FXLA2203 — Dual-Mode, Dual-SIM-Card Level Translator
August 2012
FXLA2203
Dual-Mode, Dual-SIM-Card Level Translator
Features
Easy-to-Use “Single Pin” SIM Card Swap Control
Channel Swap Time: 130ns (Typical)
Simultaneous Dual-Mode, Dual-SIM Communication
Host Ports: 1.65V to 3.6V Voltage Translation
Card Ports: 1.65V to 3.6V Voltage Translation
Leverages the Presence of Existing PMIC LDOs
ISO7816 Compliant
Power Switch R
ON
: 0.5Ω (Typical)
Supports Class B 3V SIM / UIM Cards
Supports Class C: 1.8V SIM / UIM Cards
Non-Preferential Host V
CC
Power-Up Sequencing
Activation / Deactivation Timing Compliant
per ISO7816-03
Internal Pull up Resistors for Bi-Directional I/O Pin
Outputs Switch to 3-State if Host V
CC
at GND
Power-Off Protection
Packaged in 24-Terminal UMLP (2.5mm x 3.5mm)
Direction Control Not Needed
Description
The FXLA2203 allows either two hosts to
simultaneously communicate with two Subscriber
Identity Modules (SIM), or two User Identity Modules
(UIM). Dual Mode refers to the mobile phones that are
compatible with more than one form of data
transmission or network (such as GSM, CDMA,
WCDMA, TDSCDMA, or CDMA2000), resulting in a
dual-baseband processor configuration. In a dual-mode
application, the FXLA2203 host ports interface directly
with the baseband processors
(see Figure 9).
The bi-directional I/O open-drain channel features auto-
direction and internal 10KΩ pull-up resistors. RST and CLK
provide unidirectional translation from host to card only.
Either host can swap SIM slots with the assertion of a
single control pin: CH_Swap. The typical channel swap
time is 130ns.
The FXLA2203 does not contain internal Low Dropout
Regulator (LDOs). Instead, the FXLA2203 architecture
incorporates two low-R
ON
internal power switches for
routing existing PMIC (Power Management Integrated
Circuit) LDOs to individual SIM slots. This reduces
overall system power, leverages existing LDO system
resources, and aligns with the philosophy that
centralizing LDOs in the PMIC facilitates power
management. Since the FXLA2203 does not block the
LDO function to the SIM card, existing activation /
deactivation timing transparency is maintained between
Hosts, PMICs, and SIM cards.
The device allows voltage translation from as high as
3.6V to as low as 1.65V. Each port tracks its own port
power supply.
Applications
Dual-Mode Dual-SIM Applications
GSM, CDMA, WCDMA, TDSCDMA CDMA2000,
3G Cellular Phones
Mobile TV: OMA BCAST
Ordering Information
Part Number
FXLA2203UMX
Operating
Temperature Range
-40 to 85°C
Package
24-Terminal, 2.5mm x 3.4mm Ultrathin Molded
Leadless Package (UMLP), 0.4mm Pitch
Packing
Method
Tape and Reel
© 2010 Fairchild Semiconductor Corporation
FXLA2203 • Rev. 1.0.5
www.fairchildsemi.com

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