生命周期: | Obsolete | 包装说明: | PGA, PGA66,11X11 |
Reach Compliance Code: | compliant | 风险等级: | 5.82 |
最长访问时间: | 20 ns | I/O 类型: | COMMON |
JESD-30 代码: | S-XPGA-P66 | 内存密度: | 16777216 bit |
内存集成电路类型: | SRAM MODULE | 内存宽度: | 32 |
端子数量: | 66 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 512KX32 | 输出特性: | 3-STATE |
封装主体材料: | CERAMIC | 封装代码: | PGA |
封装等效代码: | PGA66,11X11 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
电源: | 3.3 V | 认证状态: | Not Qualified |
最大待机电流: | 0.2 A | 最小待机电流: | 3 V |
子类别: | SRAMs | 最大压摆率: | 0.4 mA |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | PIN/PEG | 端子节距: | 2.54 mm |
端子位置: | PERPENDICULAR | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
WS512K32V-20H1M | ETC | 512Kx32 SRAM 3.3V MODULE |
获取价格 |
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WS512K32V-20H1MA | ETC | 512Kx32 SRAM 3.3V MODULE |
获取价格 |
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WS512K32V-70G2TC | MICROSEMI | Standard SRAM, 512KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP |
获取价格 |
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WS512K32V-70G2TCA | MICROSEMI | Standard SRAM, 512KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP |
获取价格 |
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WS512K32V-70G2TI | MICROSEMI | Standard SRAM, 512KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP |
获取价格 |
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WS512K32V-70G2TIA | MICROSEMI | Standard SRAM, 512KX32, 70ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP |
获取价格 |