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WS512K32V-20H1IA PDF预览

WS512K32V-20H1IA

更新时间: 2024-01-19 12:22:23
品牌 Logo 应用领域
其他 - ETC 内存集成电路静态存储器
页数 文件大小 规格书
8页 131K
描述
512Kx32 SRAM 3.3V MODULE

WS512K32V-20H1IA 技术参数

生命周期:Obsolete包装说明:PGA, PGA66,11X11
Reach Compliance Code:compliant风险等级:5.82
最长访问时间:20 nsI/O 类型:COMMON
JESD-30 代码:S-XPGA-P66内存密度:16777216 bit
内存集成电路类型:SRAM MODULE内存宽度:32
端子数量:66字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:512KX32输出特性:3-STATE
封装主体材料:CERAMIC封装代码:PGA
封装等效代码:PGA66,11X11封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:PARALLEL
电源:3.3 V认证状态:Not Qualified
最大待机电流:0.2 A最小待机电流:3 V
子类别:SRAMs最大压摆率:0.4 mA
标称供电电压 (Vsup):3.3 V表面贴装:NO
技术:CMOS温度等级:MILITARY
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:PERPENDICULARBase Number Matches:1

WS512K32V-20H1IA 数据手册

 浏览型号WS512K32V-20H1IA的Datasheet PDF文件第2页浏览型号WS512K32V-20H1IA的Datasheet PDF文件第3页浏览型号WS512K32V-20H1IA的Datasheet PDF文件第4页浏览型号WS512K32V-20H1IA的Datasheet PDF文件第5页浏览型号WS512K32V-20H1IA的Datasheet PDF文件第6页浏览型号WS512K32V-20H1IA的Datasheet PDF文件第7页 
WS512K32V-XXX  
HI-RELIABILITY PRODUCT  
512Kx32 SRAM 3.3V MODULE PRELIMINARY*  
FEATURES  
Access Times of 15, 17, 20ns  
Low Voltage Operation  
Packaging  
Low Power CMOS  
TTL Compatible Inputs and Outputs  
Fully Static Operation:  
• 66-pin, PGA Type, 1.075 inch square, Hermetic  
Ceramic HIP (Package 400)  
• No clock or refresh required.  
Three State Output.  
• 68 lead, 22.4mm (0.88") CQFP, 4.6mm (0.180") high,  
(Package 509)  
Built-in Decoupling Caps and Multiple Ground Pins for Low  
Noise Operation  
Weight  
• 68 lead, 23.9mm (0.940" sq.) Low Profile CQFP (G1U),  
3.56mm (0.140") high, (Package 519)  
Organized as 512Kx32; User Configurable as 1Mx16 or 2Mx8  
Commercial, Industrial and Military Temperature Ranges  
Low Voltage Operation:  
WS512K32V-XG2TX - 8 grams typical  
WS512K32V-XG1UX - 5 grams typical  
WS512K32NV-XH1X - 13 grams typical  
*
This data sheet describes a product under development, not fully  
characterized, and is subject to change without notice.  
• 3.3V ± 10% Power Supply  
PIN CONFIGURATION FOR WS512K32NV-XH1X  
TOP VIEW  
PIN DESCRIPTION  
1
12  
23  
34  
45  
56  
I/O0-31 Data Inputs/Outputs  
A0-18  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
I/O  
I/O  
8
9
WE  
2
I/O15  
I/O14  
I/O13  
I/O12  
OE  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
CS2  
CS  
4
I/O10  
GND  
I/O11  
WE  
4
VCC  
A
A
A
A
A
13  
14  
15  
16  
17  
A
A
6
7
I/O27  
GND  
NC  
A10  
A11  
A12  
VCC  
A
A
3
4
5
3
3
A
A
A
0
1
2
Not Connected  
A18  
NC  
BLOCK DIAGRAM  
WE1  
A
8
9
A
WE1CS1  
WE2CS2  
WE3CS3  
WE4CS4  
I/O  
I/O  
I/O  
I/O  
7
A
WE  
CS  
I/O23  
I/O22  
I/O21  
I/O20  
OE  
0-18  
A
I/O  
I/O  
I/O  
0
1
2
CS  
NC  
I/O  
1
6
I/O16  
I/O17  
I/O18  
512K x 8  
512K x 8  
512K x 8  
512K x 8  
5
4
GND  
I/O19  
3
8
8
8
8
11  
22  
33  
44  
55  
66  
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
May 2001 Rev. 6  
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  

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