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AM29DL640G70WHIN PDF预览

AM29DL640G70WHIN

更新时间: 2024-01-22 04:40:50
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
56页 1175K
描述
Flash, 4MX16, 70ns, PBGA63,

AM29DL640G70WHIN 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.8
最长访问时间:70 ns备用内存宽度:8
启动块:BOTTOM/TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B63JESD-609代码:e0
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
部门数/规模:16,126端子数量:63
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA63,8X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
并行/串行:PARALLEL电源:3/3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPEBase Number Matches:1

AM29DL640G70WHIN 数据手册

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Am29DL640G  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. For new and current designs,  
S29JL064H (for TSOP packages) and S29PL064J (for FBGA packages) supersede AM29DL640G as  
the factory-recommended migration path. Please refer to each respective datasheets for specifica-  
tions and ordering information. Availability of this document is retained for reference and historical  
purposes only.  
April 2005  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that  
originally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appro-  
priate, and changes will be noted in a revision summary.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 25693 Revision B Amendment 5 Issue Date June 6, 2005  

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