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AM29DL640G70PCIN PDF预览

AM29DL640G70PCIN

更新时间: 2024-01-02 16:56:18
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
56页 1175K
描述
Flash, 4MX16, 70ns, PBGA64,

AM29DL640G70PCIN 技术参数

是否Rohs认证: 不符合生命周期:Transferred
Reach Compliance Code:not_compliant风险等级:5.88
Is Samacsys:N最长访问时间:70 ns
备用内存宽度:8启动块:BOTTOM/TOP
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:S-PBGA-B64
JESD-609代码:e0内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3部门数/规模:16,126
端子数量:64字数:4194304 words
字数代码:4000000最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA64,8X8,40封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
就绪/忙碌:YES部门规模:8K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.045 mA表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
切换位:YES类型:NOR TYPE
Base Number Matches:1

AM29DL640G70PCIN 数据手册

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Am29DL640G  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. For new and current designs,  
S29JL064H (for TSOP packages) and S29PL064J (for FBGA packages) supersede AM29DL640G as  
the factory-recommended migration path. Please refer to each respective datasheets for specifica-  
tions and ordering information. Availability of this document is retained for reference and historical  
purposes only.  
April 2005  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that  
originally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appro-  
priate, and changes will be noted in a revision summary.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 25693 Revision B Amendment 5 Issue Date June 6, 2005  

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