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741X163560GP PDF预览

741X163560GP

更新时间: 2024-02-22 08:25:33
品牌 Logo 应用领域
西迪斯 - CTS /
页数 文件大小 规格书
5页 186K
描述
Chip Resistor Arrays

741X163560GP 数据手册

 浏览型号741X163560GP的Datasheet PDF文件第2页浏览型号741X163560GP的Datasheet PDF文件第3页浏览型号741X163560GP的Datasheet PDF文件第4页浏览型号741X163560GP的Datasheet PDF文件第5页 
Chip Resistor Arrays  
TechnicalData  
Features  
Low Cost  
Thick Film Technology  
High Density Packaging  
Leadless Surface Mount Construction  
Tape and Reel Packaging  
Solder Coated Nickel Barrier Pads  
Isolated and Bussed Circuits  
Concave and Convex Terminations  
RoHS Compliant Version Available  
Product Benefits  
High Density Packaging  
Up to 30% less space per resistor than 0603 chip resistors  
Up to 75% less space per resistor than 0805 chip resistors  
Placement Efficiency  
Networks require fewer placements than discrete components  
Larger overall size eases handling compared to discrete components  
Low Profile; Can be used in PCMCIA cards  
Electrical and Mechanical Specifications  
Maximum  
Operating  
Voltage  
PCB Area (in²)  
Per Resistor  
Resistance  
Range, Ohms Per Resistor*  
70°C Power  
Series  
Circuit Type  
741  
742  
743  
744  
745  
746  
0.0015  
0.0037  
0.0071  
0.0094  
0.0058  
0.0013  
Isolated  
Isolated  
Isolated  
Isolated  
Bussed  
Bussed  
10 - 1M  
10 - 1M  
10 - 1M  
10 - 1M  
33 - 470K  
33 - 100K  
.063W  
.063W  
.100W  
.125W  
.063W  
.031W  
25V  
50V  
100V  
200V  
50V  
25V  
*Total Rated Package Power equals total number of resistors times rated Power Per Resistor  
Resistance Tolerance  
Standard: ±5% or .5(whichever is greater)  
Operating Temperature Range -55°C to +125°C  
Temperature Coefficient  
Standard: 200PPM/°C  
Page 1 of 5  
May 2006  
CTS Electronic Components  
www.ctscorp.com  

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