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2FAI-M16R PDF预览

2FAI-M16R

更新时间: 2024-01-07 18:08:34
品牌 Logo 应用领域
伯恩斯 - BOURNS 消费电路商用集成电路
页数 文件大小 规格书
4页 281K
描述
Integrated Passive & Active Device using MLP

2FAI-M16R 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DFN包装说明:HVQCCN,
针数:16Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.57
商用集成电路类型:CONSUMER CIRCUITJESD-30 代码:S-XQCC-N16
JESD-609代码:e3长度:3 mm
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:0.8 mm表面贴装:YES
温度等级:INDUSTRIAL端子面层:Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

2FAI-M16R 数据手册

 浏览型号2FAI-M16R的Datasheet PDF文件第2页浏览型号2FAI-M16R的Datasheet PDF文件第3页浏览型号2FAI-M16R的Datasheet PDF文件第4页 
Features  
Applications  
Lead free as standard  
RoHS compliant*  
ESD protection  
Cell Phones  
PDAs and Notebooks  
GPS and SMART Cards  
Protects up to eight data lines  
Low insertion loss  
2FAI-M16R – Integrated Passive & Active Device using MLP  
General Information  
The 2FAI-M16R device, manufactured using Thin Film on  
Silicon technology, provides ESD protection for the external  
ports of portable electronic devices such as cell phones,  
modems and PDAs.  
I/O PADS  
GROUND  
PAD  
The ESD protection provided by the component enables a  
data port to withstand a minimum ±± ꢀK ꢁontact ꢂ±1ꢃ ꢀK Air  
Discharge per the ESD test method specified in IEꢁ 61000-4-2.  
The device measures 3 mm x 3 mm and is intended to be  
mounted directly onto an FR4 printed circuit board. The MLP  
device meets typical thermal cycle and bend test specifications.  
MLP  
PACKAGE  
Electrical & Thermal Characteristics  
Electrical Characteristics  
Symbol  
Minimum  
Nominal  
Maximum  
Unit  
(T = 2ꢃ °ꢁ unless otherwise noted)  
A
Resistance  
R
1±0  
16  
200  
20  
220  
24  
pF  
K
ꢁapacitance @ 2.ꢃ K 1 MHz  
Rated Standoff Koltage  
Breakdown Koltage @ 1 mA  
Forward Koltage @ 10 mA  
Leakage ꢁurrent @ 3 K  
K
WM  
ꢃ.0  
K
BR  
6.0  
K
K
F
0.±  
K
I
D
0.1  
µA  
ESD Protection: IEꢁ 61000-4-2  
ꢁontact Discharge  
±±  
±1ꢃ  
kK  
kK  
Air Discharge  
Thermal Characteristics  
(T = 2ꢃ °ꢁ unless otherwise noted)  
A
Dꢁ Power Rating  
P
100  
+±ꢃ  
mW  
°ꢁ  
Operating Temperature Range  
Storage Temperature Range  
T
J
-40  
-ꢃꢃ  
2ꢃ  
2ꢃ  
T
STG  
+1ꢃ0  
°ꢁ  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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