是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | DFN | 包装说明: | HVQCCN, |
针数: | 16 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.57 |
商用集成电路类型: | CONSUMER CIRCUIT | JESD-30 代码: | S-XQCC-N16 |
JESD-609代码: | e3 | 长度: | 3 mm |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
2FAJ-M16R | BOURNS | Integrated Passive & Active Device using MLP |
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|
2FAK-C15R | BOURNS | Integrated Passive & Active Device using CSP |
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|
2FAK-C15RLF | BOURNS | Integrated Passive & Active Device using CSP |
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|
2FAL-M16R | BOURNS | Integrated Passive & Active Devices |
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|
2FAM-C5R | BOURNS | Integrated Passive & Active Device using CSP |
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|
2FAM-C5RLF | BOURNS | Integrated Passive & Active Device using CSP |
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