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2FAH-C20RLF PDF预览

2FAH-C20RLF

更新时间: 2024-01-02 20:58:45
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 223K
描述
Integrated Passive & Active Device using CSP

2FAH-C20RLF 数据手册

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Features  
Lead free versions available  
RoHS compliant (lead free version)*  
New Product Development  
Integrated Passive Device  
ESD Protection to IEC61000-4-2 Spec.  
2FAH-C20R Series - Integrated Passive & Active Device using CSP  
General Information  
This application specific integrated passive component is  
designed to provide all of the necessary ESD protection  
and line resistance required on the data port of a custom  
portable electronic device. The ESD protection provided by  
the component enables the data port to withstand 8 ꢁV  
Contact / 15 ꢁV Air Discharge when tested according to  
the method specified in IEC 61ꢀꢀꢀ-4-2. The component  
incorporates 7 identical channels and is supplied in a 2ꢀ  
pin CSP package which is intended to be mounted  
directly onto an FR4 printed circuit board. This package  
will meet typical thermal cycle and bend test specifica-  
tions without the use of an underfill material.  
SOLDER  
BUMPS  
SILICON  
DIE  
Figure 1 – CSP Format  
Electrical & Thermal Characteristics  
Electrical Characteristics  
(TA = 25 °C unless otherwise noted)  
Zener Diode  
Symbol  
Minimum  
Nominal  
Maximum  
Unit  
Breakdown Voltage @ 1 mA  
Leakage Current @ 3 V  
ESD Performance (Note 1)  
Withstand  
VBR  
IR  
6
7.2  
8
1
V
µA  
Contact Discharge  
Air Discharge  
8
15  
kV  
kV  
Let Through (Note 2)  
Contact Discharge  
Air Discharge  
15ꢀ  
15ꢀ  
V
V
Channel Specification  
Resistance  
R
C
9ꢀ  
8.5  
1ꢀꢀ  
1ꢀ.5  
11ꢀ  
12.5  
pF  
Capacitance @ 1 V & 1 MHz  
Thermal Characteristics  
(TA = 25 °C unless otherwise noted)  
Operating Temperature  
Storage Temperature  
Total Power Dissipation @ 7ꢀ °C  
TJ  
Tstg  
PD  
-4ꢀ  
-6ꢀ  
25  
25  
+85  
+125  
1ꢀꢀ  
°C  
°C  
mW  
Note: 1. The IEC 61000-4-2 test method will be adapted for component level testing. The device will provide the specified ESD protection  
performance on the “IN 1-7” pins only.  
2. “Let Through” is a measure of the component of an incident ESD transient that the protection device allows through to the down  
stream circuitry.  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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