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2036-40-SM-RPLF PDF预览

2036-40-SM-RPLF

更新时间: 2024-01-13 16:56:01
品牌 Logo 应用领域
伯恩斯 - BOURNS 电信集成电路电信电路电信保护电路
页数 文件大小 规格书
3页 242K
描述
2036-xx-SM Precision Gas Discharge Tube Surge Protector

2036-40-SM-RPLF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.57JESD-30 代码:X-XXSS-X
JESD-609代码:e3湿度敏感等级:1
功能数量:1最高工作温度:85 °C
最低工作温度:-55 °C封装主体材料:UNSPECIFIED
封装形状:UNSPECIFIED封装形式:SPECIAL SHAPE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
表面贴装:NO电信集成电路类型:SURGE PROTECTION CIRCUIT
温度等级:OTHER端子面层:Tin (Sn)
端子形式:UNSPECIFIED端子位置:UNSPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

2036-40-SM-RPLF 数据手册

 浏览型号2036-40-SM-RPLF的Datasheet PDF文件第2页浏览型号2036-40-SM-RPLF的Datasheet PDF文件第3页 
Features  
Balanced Mini-TRIGARD™ Series  
High surge current rating, low insertion loss  
UL Recognized  
RoHS compliant* version available  
(5 mm diameter, 7.3 mm length)  
Ideal for board level protection of  
broadband circuits  
Leadless, surface mount for economical  
assembly  
Stable breakdown throughout life  
2036-xx-SM Precision Gas Discharge Tube Surge Protector  
Bourns now offers a surface mount (SM) 3-electrode Gas Discharge Tube (GDT) surge protection device. The industry-leading quality  
®
and features of the Bourns miniature 2036 TRIGARD™ series GDT continues in this new SM version for “pick and place”  
manufacturing techniques. The 2036 SM device is ideal for board level protection of high bandwidth applications such as xDSL,  
cable broadband and high speed Ethernet, due to its high energy handling capability, long and stable life performance and low  
capacitance of less than 2 pF. Bourns subminiature family of GDTs measure only 5 mm in diameter and are the smallest high  
®
performance GDTs in the telecom industry. Bourns GDTs are designed to prevent damage from transient disturbances by acting as  
a “crowbar” in creating a short-to-ground circuit during conduction. When a voltage transient surge exceeds the defined breakdown  
voltage level of the GDT, the device becomes ionized and conduction takes place within a fraction of a microsecond. When the surge  
passes and system voltage returns to normal levels, the GDT returns to its high-impedance (off) state.  
Characteristics  
Test Methods per ITU-T (CCITT) K.12, IEEE C62.31  
Model No.  
Characteristic  
2036-07  
2036-09  
2036-15  
2036-20  
2036-23  
2036-25  
DC Sparkover 20 ꢀ ꢁ 100 V/s  
Impulse Sparkover  
100 V/µs  
75 V  
90 V  
150 V  
200 V  
230 V  
250 V  
250 V  
525 V  
250 V  
550 V  
350 V  
500 V  
425 V  
575 V  
450 V  
600 V  
475 V  
625 V  
1000 V/µs  
Model No.  
Characteristic  
2036-30  
2036-35  
2036-40  
2036-42  
2036-47  
2036-60  
DC Sparkover 20 ꢀ ꢁ 100 V/s  
Impulse Sparkover  
100 V/µs  
300 V  
350 V  
400 V  
420 V  
470 V  
600 V  
500 V  
650 V  
600 V  
750 V  
650 V  
825 V  
675 V  
850 V  
750 V  
950 V  
850 V  
1000 V/µs  
1100 V  
Impulse Transverse Delay............................... 100 V/μs............................................................< 75 ns  
10  
Insulation Resistance (IR) ............................... 100 V (50 V for Model 2036-07 & 2036-09)......> 10  
Glow Voltage ................................................... 10 mA................................................................~ 70 V  
Arc Voltage...................................................... 1 A.....................................................................~ 10 V  
Glow-Arc Transition Current.......................................................................................................< 0.5 A  
Capacitance..................................................... 1 MHz ...............................................................< 2 pF  
Ω
1
DC Holdover Voltage .................................... >135 V, (52 V for Model 2036-07, & -09, ..........< 150 ms  
......................................................................... 80 V for Model 2036-15)  
2
Impulse Discharge Current.............................. 20000 A, 8/20 µs ............................................. 1 operation minimum  
10000 A, 8/20 µs...............................................> 10 operations  
200 A, 10/1000 µs ............................................> 300 operations  
2000 A, 10/350 µs............................................. 1 operation  
200 A, 10/700 µs ..............................................> 500 operations  
2
Alternating Discharge Current......................... 20 Arms, 1 s .................................................... 1 operation minimum  
10 Arms, 1 s......................................................> 10 operations  
Operating Temperature............................................................................................................... -55 to +85 °C  
Climatic Category (IEC 60068-1)................................................................................................ 40/90/21  
Notes:  
UL Recognized component, UL File E153537.  
No model number marking on tube; date code and voltage only: month year digits, xxxV (e.g. 0209 400V).  
The rated discharge current for Mini-TRIGARD™ GDTs is the total current equally divided between each line to ground.  
Surface Mount (SM) parts may show a temporary increase in DCBD after the solder reflow process. Most devices will recover within 24  
hours time. It should be noted that there is no quality defect nor change in protection levels during the temporary change in DCBD.  
8
Sparkover limits after life 25 ꢀ (-25 ꢀ,+30 ꢀ for Model 2036-07, 2036-09 and 2036-60), IR >10 Ω.  
Operating characteristics per RUS PE-80 and Telcordia GR 1361 available on request.  
Line to Line voltage is approximately 1.8 to 2 times the stated Line to Ground breakdown voltage.  
At delivery AQL 0.65 Level II, DIN ISO 2859.  
1
2
Network applied.  
DC Sparkover may exceed 25 ꢀ but will continue to protect without venting.  
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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