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AMIS-710206-A4 PDF预览

AMIS-710206-A4

更新时间: 2024-02-02 11:07:18
品牌 Logo 应用领域
AMI 传感器换能器图像传感器
页数 文件大小 规格书
9页 304K
描述
200dpi CIS Modules

AMIS-710206-A4 技术参数

生命周期:TransferredReach Compliance Code:compliant
风险等级:5.76Is Samacsys:N
Base Number Matches:1

AMIS-710206-A4 数据手册

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AMIS-710205-A4/AMIS-710206-A4: 200dpi CIS Modules  
Data Sheet  
1.0 General Description  
The AMIS-710205-A4 (PI205MC-A4-R) and AMIS-710206-A4 (PI206MC-A4-R) are a family of contact image sensor (CIS) modules. As  
a family group they are called AMIS-710205/206 modules. They are long contact image sensor modules, using MOS image sensor  
technology for high-speed performance and high sensitivity. They contain their own complete optical system including the light source;  
accordingly, they make a very compact imaging system. The four parallel video outputs give this family of CIS modules their high speed  
performance. They all possess identical electrical circuit components, as well as the same mechanical and optical components, except  
for their LED light sources. They differ in their specification, however, because the different light sources impact the efficacy of the high  
speed performance.  
The two modules are suitable for scanning A4 size (216mm) documents with eight dots per millimeter (dpm) resolution. Applications  
include document scanning, mark readers, gaming and office automation equipment.  
2.0 Key Features  
Light source, lens and sensor are integrated into a single module  
Ultra high-speed  
Four parallel analog video outputs clocked at 5.0MHz  
90µsec/line scanning speed @ 5.0MHz clock rate with optional light sources, selected from the option of two above modules  
8dpm resolution, 216mm scanning length  
Wide dynamic range  
LED light source (selectable among the two above modules)  
Standard A4 size 14mm x 19mm x 232mm  
Low power  
Light weight  
3.0 Functional Description  
Each of the two modules in the family AMIS-710205/206 consists of four major components. The first of them is the printed circuit board  
(PCB) on which the 27 imaging chips, AMIS-720233 (PI3033), are bonded. These sensor chips, produced by AMI Semiconductor, are  
monolithic devices with 64 photo sensing elements. Each of 27 chips are completely self-contained scanning chips with their control  
circuits integrated within the chips, so that they can be cascaded to provide a 1728 photo-elements module. The AMIS-720233 chips  
are integrated with the photo sensors' associated multiplex switches, a digital shift register and the chip selection switch. The chip's shift  
register sequentially clocks out the integrated image charges from each sensing element and passes them through the chip-select  
switch and out onto the video line. The chip-select switches are sequentially switched as each of the predecessor chips completes its  
scan. These 27 sensors, bonded on a PCB, are grouped into four sub-cascaded sections. Each contiguously cascaded chip section is  
connected on separate video lines, providing four video outputs, VOUT1, VOUT2, VOUT3, and VOUT4. Before the signal charges from  
the four video lines appear at their respective outputs, they are converted to signal voltages by four on-board buffer amplifiers; one for  
each of its corresponding video section. The first three sections, VOUT1, VOUT2 and VOUT3 have seven sensor chips, while the  
VOUT4 has six sensor chips. Since each sensor chip has 64 pixels, there are a total of 1728 pixels (see Figure 1).  
Mounted in the module housing, along with the PCB, is the second major component. It is a one-to-one graded indexed micro lens  
array, which focuses the image of the scanned documents onto the sensing line of the sensor chips. The third major component  
mounted in the module is the LED light source (see Figure 2). This pictorial cross section shows the LED bar light source and its  
illumination path as it reflects the image from the document and focuses through the ROD lens on to the image sensing line of the  
sensing chips. All components are housed in a small plastic housing and covered with the fourth major component, a glass window.  
This cover glass not only serves to protect all of the critical components within the housing from dust, but it also serves a minor role in  
the optical system. Together with rest of the module's optical system, the module is adjusted to obtain the optimum depth-of-focus.  
AMI Semiconductor – Aug. 06, M-20608-001  
1
www.amis.com  

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