5秒后页面跳转
AM45DL3208GB85IS PDF预览

AM45DL3208GB85IS

更新时间: 2024-01-13 03:57:05
品牌 Logo 应用领域
超微 - AMD 闪存内存集成电路静态存储器
页数 文件大小 规格书
66页 1202K
描述
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AM45DL3208GB85IS 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:73Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.23
Is Samacsys:N其他特性:STATIC RAM IS ORGANIZED AS 512K X 16/1M X 8
JESD-30 代码:R-PBGA-B73JESD-609代码:e0
长度:11.6 mm内存密度:33554432 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:73字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2MX16封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):240
认证状态:Not Qualified座面最大高度:1.4 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:8 mm
Base Number Matches:1

AM45DL3208GB85IS 数据手册

 浏览型号AM45DL3208GB85IS的Datasheet PDF文件第2页浏览型号AM45DL3208GB85IS的Datasheet PDF文件第3页浏览型号AM45DL3208GB85IS的Datasheet PDF文件第4页浏览型号AM45DL3208GB85IS的Datasheet PDF文件第5页浏览型号AM45DL3208GB85IS的Datasheet PDF文件第6页浏览型号AM45DL3208GB85IS的Datasheet PDF文件第7页 
Am45DL3208G  
Data Sheet  
September 2003  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-  
inally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appropriate,  
and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM. To order  
these products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 26460 Revision B Amendment +1 Issue Date March 12, 2004  

与AM45DL3208GB85IS相关器件

型号 品牌 描述 获取价格 数据表
AM45DL3208GB85IT AMD Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

获取价格

AM45DL3208GB85IT SPANSION Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

获取价格

AM45DL3208GT70FS SPANSION Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

获取价格

AM45DL3208GT70FT SPANSION Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

获取价格

AM45DL3208GT70IS SPANSION Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

获取价格

AM45DL3208GT70IS AMD Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

获取价格