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AM29DL163D PDF预览

AM29DL163D

更新时间: 2022-01-31 19:14:46
品牌 Logo 应用领域
超微 - AMD 闪存静态存储器
页数 文件大小 规格书
58页 783K
描述
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AM29DL163D 数据手册

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DS42546  
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM  
Am29DL163D Top Boot 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only,  
Simultaneous Operation Flash Memory and 4 Mbit (512 K x 8-Bit/ 256 K x 16-Bit) Static RAM  
DISTINCTIVE CHARACTERISTICS  
SOFTWARE FEATURES  
MCP Features  
Power supply voltage of 2.7 to 3.3 volt  
Data Management Software (DMS)  
AMD-supplied software manages data programming and  
erasing, enabling EEPROM emulation  
Eases sector erase limitations  
High performance  
85 ns maximum access time  
Package  
Supports Common Flash Memory Interface (CFI)  
Erase Suspend/Erase Resume  
69-Ball FBGA  
Operating Temperature  
Suspends erase operations to allow programming in same  
bank  
–25°C to +85°C  
Data# Polling and Toggle Bits  
Flash Memory Features  
Provides a software method of detecting the status of  
program or erase cycles  
ARCHITECTURAL ADVANTAGES  
Unlock Bypass Program command  
Simultaneous Read/Write operations  
Reduces overall programming time when issuing multiple  
program command sequences  
Data can be continuously read from one bank while  
executing erase/program functions in other bank  
Zero latency between read and write operations  
HARDWARE FEATURES  
Secured Silicon (SecSi) Sector: Extra 64 KByte sector  
Any combination of sectors can be erased  
Factory locked and identifiable: 16 bytes available for  
secure, random factory Electronic Serial Number; verifiable  
as factory locked through autoselect function.  
Ready/Busy# output (RY/BY#)  
Hardware method for detecting program or erase cycle  
completion  
Customer lockable: Can be read, programmed, or erased  
just like other sectors. Once locked, data cannot be changed  
Hardware reset pin (RESET#)  
Hardware method of resetting the internal state machine to  
reading array data  
Zero Power Operation  
Sophisticated power management circuits reduce power  
consumed during inactive periods to nearly zero  
WP#/ACC input pin  
Write protect (WP#) function allows protection of two outermost  
boot sectors, regardless of sector protect status  
Top boot block  
Manufactured on 0.23 µm process technology  
Acceleration (ACC) function accelerates program timing  
Compatible with JEDEC standards  
Sector protection  
Pinout and software compatible with single-power-supply  
flash standard  
Hardware method of locking a sector, either in-system or  
using programming equipment, to prevent any program or  
erase operation within that sector  
PERFORMANCE CHARACTERISTICS  
Temporary Sector Unprotect allows changing data in  
protected sectors in-system  
High performance  
85 ns access time  
Program time: 7 µs/word typical utilizing Accelerate function  
SRAM Features  
Power dissipation  
Ultra low power consumption (typical values)  
2 mA active read current at 1 MHz  
Operating: 50 mA maximum  
Standby: 7 µA maximum  
10 mA active read current at 5 MHz  
200 nA in standby or automatic sleep mode  
CE1#s and CE2s Chip Select  
Minimum 1 million write cycles guaranteed per sector  
20 Year data retention at 125°C  
Power down features using CE1#s and CE2s  
Data retention supply voltage: 1.5 to 3.3 volt  
Byte data control: LB#s (DQ0–DQ7), UB#s (DQ8–DQ15)  
Reliable operation for the life of the system  
Publication# 24137 Rev: B Amendment/1  
Issue Date: March 15, 2001  
This document contains information on a product under development at Advanced Micro Devices. The information  
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed  
product without notice.  
Refer to AMD’s Website (www.amd.com) for the latest information.  

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