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AMMC-3040-W50 PDF预览

AMMC-3040-W50

更新时间: 2024-01-17 05:42:23
品牌 Logo 应用领域
安捷伦 - AGILENT 射频和微波射频混频器微波混频器放大器局域网
页数 文件大小 规格书
6页 309K
描述
18-36 GHz Double-Balanced Mixer with Integrated LO Amplifier/Multiplier

AMMC-3040-W50 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:DIE OR CHIP
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.36
其他特性:USABLE TO 42 GHZ特性阻抗:50 Ω
构造:COMPONENT最大变频损耗:12 dB
最大工作频率:36000 MHz最小工作频率:18000 MHz
封装等效代码:DIE OR CHIP电源:2/5 V
射频/微波设备类型:DOUBLE BALANCED子类别:RF/Microwave Mixers

AMMC-3040-W50 数据手册

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Agilent AMMC-3040  
18-36 GHz Double-Balanced Mixer  
with Integrated LO Amplifier/  
Multiplier  
Data Sheet  
Features  
• High IIP3 : +23 dBm  
• Wide Bandwidth  
• RF: 18-36 GHz  
• LO: 18-36 GHz  
• IF: DC-3 GHz  
• Fundamental or Sub-Harmonic  
Mixing  
Chip Size:  
2520 x 760 µm (99.2 x 29.9 mils)  
• Up or Down Converter  
Chip Size Tolerance:  
Chip Thickness:  
Pad Dimensions:  
ꢀ0 µm ( 0.ꢁ mils)  
• Conversion Loss: 9.5dB  
• P1dB : +17 dBm  
• Low LO Drive Power: + 2 dBm  
• Usable to 42 GHz  
Applications  
ꢀ00 ꢀ0 µm (ꢁ 0.ꢁ mils)  
75 x 75 µm (3 0.ꢁ mils)  
Description  
The AMMC-3040 is a broadband  
Double-Balanced Mixer (DBM)  
with an integrated high-gain LO  
amplifier. This MMIC can be  
used as either an up converter  
or down converter in microwave  
or millimeter wave applications.  
If desired, the LO amplifier can  
be biased to function as a  
frequency multiplier to enable  
second harmonic mixing of the  
LO input. The mixer section  
ofthe AMMC-3040 is fabricated  
using a suspended metal system  
to create a unique, broadside-  
coupled balun structure (patent  
pending) to achieve exceptional  
bandwidth. The MMIC provides  
repeatable conversion loss  
• Point-to-Point Radio  
• LMDS  
• SATCOM  
[1]  
AMMC-3040 Absolute Maximum Ratings  
Symbol  
Parameters/Conditions  
Positive Drain Voltage  
Gate Voltage  
Units  
V
Min.  
Max.  
5
V
V
Dꢀ, 2, 3, ꢁ  
Gꢀ, 2, 3, ꢁ  
V
-3.0  
0.5  
I
Total Drain Current  
mA  
°C  
550  
+ꢀ60  
dd  
T
Operating Channel Temp.  
Operating Backside Temp.  
Storage Case Temp.  
ch  
T
°C  
-55  
-65  
b
T
°C  
+ꢀ65  
+300  
stg  
T
Maximum Assembly Temp (60 sec max) °C  
max  
without tuning, making it highly  
suitable for automated assembly  
processes.  
Note:  
ꢀ. Operation in excess of any one of these conditions may result in permanent damage to this device.  
Note: These devices are ESD sensitive. The following precautions are strongly recommended:  
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.  
Personal grounding is to be worn at all times when handling these devices.  

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