是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP-240 | 针数: | 240 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.22 |
Is Samacsys: | N | 地址总线宽度: | 32 |
桶式移位器: | YES | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 40 MHz |
外部数据总线宽度: | 48 | 格式: | FLOATING POINT |
内部总线架构: | MULTIPLE | JESD-30 代码: | S-CQFP-G240 |
JESD-609代码: | e4 | 长度: | 32 mm |
低功率模式: | YES | 端子数量: | 240 |
最高工作温度: | 100 °C | 最低工作温度: | -40 °C |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | HFQFP |
封装等效代码: | HQFP240,1.37SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字数): | 131072 | 座面最大高度: | 4.2 mm |
子类别: | Digital Signal Processors | 最大压摆率: | 850 mA |
最大供电电压: | 5.25 V | 最小供电电压: | 4.75 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Gold (Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 32 mm |
uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ADSP-21060CWZ-133 | ADI | IC 48-BIT, 33.3 MHz, OTHER DSP, CQFP240, LEAD FREE, THERMALLY ENHANCED, METRIC, HEAT SINK, |
获取价格 |
|
ADSP-21060CWZ-160 | ADI | IC 48-BIT, 40 MHz, OTHER DSP, CQFP240, THERMALLY ENHANCED, METRIC, HEAT SINK, CERAMIC, QFP |
获取价格 |
|
ADSP-21060CZ-133 | ADI | ADSP-21060 Industrial SHARC DSP Microcomputer Family |
获取价格 |
|
ADSP-21060CZ-160 | ADI | SHARC Processor |
获取价格 |
|
ADSP-21060CZZ-133 | ADI | IC 48-BIT, 33.3 MHz, OTHER DSP, CQFP240, LEAD FREE, THERMALLY ENHANCED, HEAT SINK, CERAMIC |
获取价格 |
|
ADSP-21060CZZ-160 | ADI | IC 48-BIT, 40 MHz, OTHER DSP, CQFP240, LEAD FREE, THERMALLY ENHANCED, HEAT SINK, CERAMIC, |
获取价格 |