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AK5816384SP-70 PDF预览

AK5816384SP-70

更新时间: 2024-02-04 20:23:08
品牌 Logo 应用领域
ACCUTEK 存储内存集成电路动态存储器
页数 文件大小 规格书
2页 85K
描述
16,777,216 Word by 8 Bit CMOS Dynamic Random Access Memory

AK5816384SP-70 技术参数

生命周期:Contact Manufacturer零件包装代码:SIMM
包装说明:SIMM, SIM30针数:30
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.72
Is Samacsys:N访问模式:FAST PAGE
最长访问时间:70 ns其他特性:RAS ONLY/CAS BEFORE RAS REFRESH
I/O 类型:COMMONJESD-30 代码:R-XSMA-N30
内存密度:134217728 bit内存集成电路类型:FAST PAGE DRAM MODULE
内存宽度:8功能数量:1
端口数量:1端子数量:30
字数:16777216 words字数代码:16000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:16MX8
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:SIMM封装等效代码:SIM30
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:5 V认证状态:Not Qualified
刷新周期:2048座面最大高度:20.32 mm
子类别:DRAMs标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:2.54 mm端子位置:SINGLE
Base Number Matches:1

AK5816384SP-70 数据手册

 浏览型号AK5816384SP-70的Datasheet PDF文件第2页 
Accutek  
Microcircuit  
Corporation  
AK5816384S / AK5816384G  
16,777,216 Word by 8 Bit CMOS  
Dynamic Random Access Memory  
DESCRIPTION  
Front View  
30-Pin SIM  
The Accutek AK5816384 high density memory module is a CMOS  
DRAM organized in 16 Meg x 8 bit words. The assembly consists of  
eight 16 Meg x 1 DRAMs in plastic SOJ packages mounted to the  
front side of a printed circuit board in 30 pad SIM (leadless) or SIP  
(leaded) configuration. The module is only 0.8 inch high (same  
height as standard 1 Meg modules), making it ideally suited for ap-  
plications with low height restrictions.  
1
30  
30-Pin SIP  
The operation of the AK5816384 is identical to eight 16 Meg x 1  
DRAMs. The data input is tied to the data output and brought out  
separately for each device, with common RAS, CAS and WE con-  
trol. This common I/O feature dictates the use of early-write cycles  
to prevent contention of D and Q. Since the Write-Enable (WE) sig-  
nal must always go low before CAS in a write cycle, Read-Write and  
Read-Modify-Write operation is not possible.  
1
FEATURES  
· 16,777,216 x 8 bit organization  
· 4096 Cycle Refresh every 64mSEC  
· Optional 30 Pad leadless SIM (Single In-Line Module) or 30  
Pin leaded SIP (Single In-Line Package)  
· Power:  
3.96 Watt Max Active (60 nS)  
4.40 Watt Max Active (70 nS)  
3.52 Watt Max Active (80 nS)  
44 mWatt Max Standby  
· JEDEC standard pinout  
· Each device (data bit) has common DQ lines with common  
CAS and RAS controls  
· Operating free air temperature 0oC to 70oC  
· CAS-before-RAS refresh  
· Downward compatible with AK584096, AK581024/481024,  
AK58256/48256  
· Fast Page Mode  
· 9 Bit version (with parity bit) also available  
· TTL-Compatible Inputs and Outputs  
· RAS-Only Refresh  
PIN NOMENCLATURE  
PIN ASSIGNMENT  
FUNCTIONAL DIAGRAM  
PIN #  
1
SYMBOL  
Vcc  
CAS  
DQ1  
A0  
PIN #  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
SYMBOL  
DQ5  
A8  
DQ1 - DQ8  
A0 - A11  
CAS  
Data In/Data Out  
Address Inputs  
Column Address Strobe  
Row Address Strobe  
Write Enable  
2
3
A9  
4
A10  
DQ6  
WE  
RAS  
5
A1  
WE  
6
DQ2  
A2  
Vcc  
5v Supply  
7
Vss  
8
A3  
DQ7  
A11  
DQ8  
NC  
Vss  
Ground  
9
Vss  
DQ3  
A4  
NC  
No Connect  
10  
11  
12  
13  
14  
15  
A5  
RAS  
NC  
MODULE OPTIONS  
DQ4  
A6  
NC  
Leadless SIM: AK5816384S  
Leaded SIP: AK5816384G  
A7  
Vcc  

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