是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DIP |
包装说明: | 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.24 |
Is Samacsys: | N | 备用内存宽度: | 8 |
最大时钟频率 (fCLK): | 2 MHz | JESD-30 代码: | R-PDIP-T8 |
JESD-609代码: | e3 | 长度: | 9.46 mm |
内存密度: | 1024 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 128 words |
字数代码: | 128 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 128X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 4.32 mm | 串行总线类型: | MICROWIRE |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.8 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 7.62 mm |
最长写入周期时间 (tWC): | 6 ms | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
93LC66AT-I/PG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66A-TI/SN | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | |
93LC66AT-I/SN | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/SN15KVAO | MICROCHIP |
获取价格 |
EEPROM, 512X8, Serial, CMOS, PDSO8 | |
93LC66AT-I/SNA21 | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | |
93LC66A-TI/SNG | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, MS-012, SOIC-8 | |
93LC66AT-I/SNG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/SNVAO | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | |
93LC66ATI/ST | ETC |
获取价格 |
Microwire Serial EEPROM | |
93LC66A-TI/ST | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8 |