是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SON |
包装说明: | 2 X 3 MM, 0.90 MM HEIGHT, LEAD FREE, PLASTIC, MO-229, DFN-8 | 针数: | 8 |
Reach Compliance Code: | compliant | 风险等级: | 5.26 |
最大时钟频率 (fCLK): | 3 MHz | JESD-30 代码: | R-PDSO-N8 |
JESD-609代码: | e3 | 长度: | 3 mm |
内存密度: | 4096 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 512 words | 字数代码: | 512 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 512X8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
串行总线类型: | MICROWIRE | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 2 mm | 最长写入周期时间 (tWC): | 6 ms |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
93LC66AT-I/MC | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/MCG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66A-TI/MS | MICROCHIP |
获取价格 |
暂无描述 | |
93LC66AT-I/MS | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/MSG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66A-TI/OT | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO6, LEAD FREE, PLASTIC, SC-74A, SOT-23, 6 PIN | |
93LC66AT-I/OT | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66A-TI/OTG | MICROCHIP |
获取价格 |
512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO6, LEAD FREE, PLASTIC, SC-74A, SOT-23, 6 PIN | |
93LC66AT-I/OTG | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM | |
93LC66AT-I/P | MICROCHIP |
获取价格 |
4K Microwire Compatible Serial EEPROM |