Datasheet > 935313028518

935313028518

更新时间： 2024-09-26 19:51:15

品牌	Logo	应用领域
恩智浦 - NXP		时钟微控制器外围集成电路
页数	文件大小	规格书
133页	1493K
描述
RISC Microcontroller

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935313028518 技术参数

生命周期：	Active	包装说明：	LFBGA,
Reach Compliance Code：	unknown	风险等级：	5.74
具有ADC：	YES	地址总线宽度：
位大小：	32	最大时钟频率：	32 MHz
DMA 通道：	YES	外部数据总线宽度：
长度：	8 mm	I/O 线路数量：	85
端子数量：	121	PWM 通道：	YES
封装代码：	LFBGA	封装形状：	SQUARE
封装形式：	GRID ARRAY, LOW PROFILE, FINE PITCH	速度：	72 MHz
最大供电电压：	3.6 V	最小供电电压：	1.71 V
标称供电电压：	3.3 V	表面贴装：	YES
端子形式：	BALL	端子节距：	0.65 mm
端子位置：	BOTTOM	宽度：	8 mm
uPs/uCs/外围集成电路类型：	MICROCONTROLLER, RISC	Base Number Matches：	1

935313028518 数据手册

NXP Semiconductors

Data Sheet: Technical Data

Document Number: KL82P121M72SF0

Rev. 4, 12/2016

Kinetis KL82 Microcontroller

MKL82Z128Vxx7(R)

72 MHz ARM® Cortex®-M0+ with 128 KB Flash and 96 KB

SRAM

The KL82 MCU family's high performance, encryption features

and ultra-low power capabilities extend its reach beyond

traditional mPOS pin pads and terminals into more power-

restricted payment applications, such as smartphone and tablet

attach readers, as well as those embedded in wearable

technology.

100 & 80 & 64 LQFP

(LL&LK&LH)

14x14 x1.7 mm Pitch

121 & 64 MAPBGA

(MC&MP)

8x8x1.43 mm Pitch 0.5mm 12x12x1.6 mm

0.65 mm 5x5x1.23 mm

Pitch 0.5 mm

10x10x1.6 mm Pitch

0.5 mm

The product offers:

• Hardware asymmetric cryptography – high-speed, code-

and power-efficient data authentication with support for

latest encryption protocols

• EMV®-compatible with ISO7816-3 SIM interfaces – architected for EMV compliance and supported by

an EMV Level 1 software stack

• QSPI interface to expand program memory

• Sleep mode power consumption from 2.5 µA with the SRAM content retained and RTC enabled

• Crystal-less USB OTG controller, 16-bit ADC and multiple serial communication interfaces can all

function autonomously in low-power modes with minimal CPU intervention

• FlexIO to support any standard and customized serial peripheral emulation

Core Processor

Peripherals

• USB full-speed 2.0 OTG controller supporting

• 72 MHz ARM® Cortex®-M0+ core ( up to 96 MHz for high-

speed run)

crystal-less operation and keeping connection

alive under ultra-low power

Memories

• Three low-power UART modules supporting

asynchronous operation in low-power modes

• Two I2C modules supporting up to 1 Mbps

• Two 16-bit SPI modules supporting up to

24Mbps

• 128 KB program flash memory

• 96 KB SRAM

• 32 KB ROM with built-in boot loader

• 32 B backup register

• QSPI to expand program code in external high-speed serial

NOR flash memory

• One FlexIO module supporting emulation of

additional UART, SPI, I2C, I2S, PWM and

other serial modules, etc. up to 32 channels

• One 16-bit ADC module with high accurate

internal voltage reference and up to 16

channels

System

• 8-channel asynchronous enhanced DMA controller

• Watchdog

• Low-leakage wakeup unit

• Two-pin serial wire debug (SWD) programming and

debugging interface

• Micro trace buffer

• Bit manipulation engine

• Interrupt controller

• High-speed analog comparator containing a 6-

bit DAC for programmable reference input

• One 12-bit DAC module

• Two EMVSIM modules supporting EMV L1

compatible interface

• Touch sensing interface up to 16 channels

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

12 3 4 5 6 7...133

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