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8V16245AMDLREPG4 PDF预览

8V16245AMDLREPG4

更新时间: 2024-01-12 01:48:12
品牌 Logo 应用领域
德州仪器 - TI 总线收发器输出元件
页数 文件大小 规格书
17页 644K
描述
3.3-V ABT 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS

8V16245AMDLREPG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SSOP
包装说明:SSOP,针数:48
Reach Compliance Code:compliantHTS代码:8542.39.00.01
Factory Lead Time:6 weeks风险等级:5.54
控制类型:COMMON CONTROL计数方向:BIDIRECTIONAL
系列:LVTJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:15.88 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS TRANSCEIVER
最大I(ol):0.024 A湿度敏感等级:1
位数:8功能数量:2
端口数量:2端子数量:48
最高工作温度:125 °C最低工作温度:-55 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
包装方法:TR峰值回流温度(摄氏度):260
最大电源电流(ICC):0.005 mAProp。Delay @ Nom-Sup:4.5 ns
传播延迟(tpd):4.6 ns认证状态:Not Qualified
施密特触发器:No座面最大高度:2.79 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED翻译:N/A
宽度:7.49 mmBase Number Matches:1

8V16245AMDLREPG4 数据手册

 浏览型号8V16245AMDLREPG4的Datasheet PDF文件第2页浏览型号8V16245AMDLREPG4的Datasheet PDF文件第3页浏览型号8V16245AMDLREPG4的Datasheet PDF文件第4页浏览型号8V16245AMDLREPG4的Datasheet PDF文件第5页浏览型号8V16245AMDLREPG4的Datasheet PDF文件第6页浏览型号8V16245AMDLREPG4的Datasheet PDF文件第7页 
SN74LVTH16245A-EP  
3.3-V ABT 16-BIT BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCAS693GAPRIL 2003REVISED OCTOBER 2006  
FEATURES  
DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
Controlled Baseline  
– One Assembly  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1DIR  
1B1  
1B2  
GND  
1B3  
1B4  
VCC  
1OE  
1A1  
1A2  
GND  
1A3  
1A4  
VCC  
– One Test Site  
2
– One Fabrication Site  
3
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
4
5
Enhanced Product-Change Notification  
6
(1)  
Qualification Pedigree  
7
8
1B5  
1B6  
GND  
1B7  
1B8  
2B1  
2B2  
GND  
2B3  
2B4  
VCC  
1A5  
1A6  
GND  
1A7  
1A8  
2A1  
2A2  
GND  
2A3  
2A4  
VCC  
Member of the Texas Instruments Widebus™  
Family  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V Operation  
and Low Static-Power Dissipation  
Supports Mixed-Mode Signal Operation (5-V  
Input and Output Voltages With 3.3-V VCC  
)
Supports Unregulated Battery Operation  
Down to 2.7 V  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
2B5  
2B6  
GND  
2B7  
2B8  
2DIR  
2A5  
2A6  
GND  
2A7  
2A8  
2OE  
Distributed VCC and GND Pins Minimize  
High-Speed Switching Noise  
Flow-Through Architecture Optimizes PCB  
Layout  
Ioff and Power-Up 3-State Support Hot  
Insertion  
Bus Hold on Data Inputs Eliminates the Need  
for External Pullup/Pulldown Resistors  
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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