Datasheet > 8SOIC

8SOIC

更新时间： 2024-09-23 21:54:11

品牌	Logo	应用领域
SMSC		/
页数	文件大小	规格书
1页	295K
描述
8 PIN SOIC PACKAGE OUTLINE

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中文翻译

获取价格

数据手册

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8SOIC 数据手册

8 PIN SOIC/SOIN PACKAGE OUTLINE

SEE DETAIL "A"

0.25

GAUGE PLANE

0°-8°

INDEX AREA

(D/2 X E1/2)

8X b

END VIEW

DETAIL "A" (SCALE: 3/1)

TOP VIEW

SEATING PLANE

ccc

SIDE VIEW

3-D VIEW

Min

1.35

0.10

1.25

4.80

5.80

3.80

0.40

Nominal

Max

1.75

0.25

1.65

5.00

6.20

4.00

0.90

Remarks

Overall Package Height

Standoff

Package Body Thickness

"X" Body Size

Lead Span

4.90

6.00

3.90

"Y" Body Size

Lead Foot Length

Lead Length

1.05 REF

0.31

0.17

0.51

0.25

Lead Width

Lead Thickness

Lead Pitch

1.27 BSC

ccc

0.10

Coplanarity

Notes:

1. All dimensions are in millimeters.

2. True position spread tolerance of each lead is ±0.125mm at maximum material condition.

3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gate

burrs is 0.15mm per end. Dimension "E1" does not include inter-lead flash or protrusion. Maximum inter-lead

flash or protrusion is 0.25mm per side. Dimensions "D" & "E1" are determined at the datum plane "H".

4. Dimensions "b" and "c" apply to the flat section of the lead between 0.10 to 0.25mm from the lead tip.

5. Details of pin 1 identifier are optional, but must be located within the index area indicated.

6. Provided for reference only - contact your SMSC Regional Sales Office for latest information.

80 Arkay Drive

Hauppauge, NY 11788

(631) 435-6000

Rev. 8/23/05

FAX (631) 273-3123

中文翻译

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