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897-10-010-40-300002 PDF预览

897-10-010-40-300002

更新时间: 2024-01-14 23:46:14
品牌 Logo 应用领域
仕元机械 - MILL-MAX 局域网PC连接器
页数 文件大小 规格书
1页 398K
描述
Telecom and Datacom Connector, 10 Contact(s), Male, Right Angle, Surface Mount Terminal, Locking, Receptacle, PFOA, PFOS, ROHS AND REACH COMPLIANT

897-10-010-40-300002 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:PFOA, PFOS, ROHS AND REACH COMPLIANT
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8536.90.40.00风险等级:1.69
板上安装选件:SOLDER HOLDING FLANGE主体宽度:0.116 inch
主体深度:0.205 inch主体长度:0.526 inch
主体/外壳类型:RECEPTACLE连接器类型:USB CONNECTOR
联系完成配合:GOLD (10) OVER NICKEL (150)联系完成终止:Gold (Au) - with Nickel (Ni) barrier
触点性别:MALE触点材料:NOT SPECIFIED
介电耐压:100VAC V耐用性:10000 Cycles
最大插入力:2.1684 N绝缘电阻:100000000 Ω
JESD-609代码:e4安装选项1:LOCKING
安装方式:RIGHT ANGLE安装类型:BOARD
连接器数:ONEPCB行数:1
最高工作温度:85 °C最低工作温度:-40 °C
PCB接触模式:RECTANGULAR电镀厚度:15u inch
参考标准:UL可靠性:COMMERCIAL
外壳面层:NICKEL外壳材料:STAINLESS STEEL
子类别:Telecom and Datacom Connectors端子节距:0.6604 mm
端接类型:SURFACE MOUNT触点总数:10
撤离力-最小值:.6116 NBase Number Matches:1

897-10-010-40-300002 数据手册

  
IO SOCKETS  
-
SERIES 897 • UNIVERSAL SERIAL BUS 3.0 MICRO B • SURFACE MOUNT SOCKETS  
USB 3.0 Micro-B receptacles for surface mount  
Reduced mounting space  
Fully shielded  
.482  
.136  
P5  
.264  
.079  
P1  
P6  
P10  
.097  
Fully backwards compatible with USB 2.0  
10X faster than USB 2.0 and provides  
optimized power efficiency  
TYP.  
.026  
.047  
TYP.  
.102  
.059  
.138  
.132  
.687  
.528  
Smaller and lighter than existing USB  
connectors, for portable & handheld devices  
.118  
Packaged on Tape and Reel:  
897-10-010-00-300002 - 900 pieces per reel  
897-10-010-40-300002 - 1,500 pieces per reel  
.016  
ORDERING INFORMATION  
Micro Type B Receptacle, Single, Vertical Surface Mount  
.105  
.035  
.608  
Ø.028  
.304  
.262  
.063  
FIG. 1  
897ꢀ10ꢀ010ꢀ00ꢀ300002  
TYP.  
.065  
Micro Type B Receptacle, Single, Surface Mount  
.026 TYP.  
.102 TYP.  
TYP.  
.016  
FIG. 2  
.106  
897ꢀ10ꢀ010ꢀ40ꢀ300002  
.199  
.264  
FIG. 1  
Technical Specifications  
Materials:  
.557  
.506  
.366  
RoHS-2  
2011/65/EU  
Terminals: Copper Alloy, Gold Flash over Ni  
Contacts: Copper Alloy, 15 μGold-Plated over Ni  
Shell material: Stainless Steel, Nickel-Plated  
.026 TYP.  
.012 TYP.  
Insulator material: High temperature LCP thermoplastic rated UL94V-0  
Ratings:  
Voltage: 30VAC (rms)  
Current: 1.5A (Pin 1 and 5), .25A (other pins)  
All housing materials rated for “lead-freesoldering up to 260º C  
.526  
Electrical:  
Contact resistance: 30mW max. (Pin 1 and 5)  
50mW max. (other pins)  
Insulation resistance: 100MW min.  
Dielectric withstanding voltage: 100VAC for 1 minute at sea level  
Mechanical:  
.482  
.264  
.136  
.073  
2,54  
.051  
.102  
.102  
.031  
TYP.  
Random vibration: No discontinuity >1μs per EIA 364-28, cond. V, letter A  
Durability: 10,000 cycles max. per EIA 364-09  
.264  
TYP.  
.026  
P1  
P10  
Mating force: 35 Newtons max. per EIA 364-13  
.053  
.057  
Unmating force: Initial - 10 Newtons min. per EIA 364-13  
After test - 8 Newtons min. per EIA 364-13  
.075  
Environmental:  
PCB EDGE  
.122  
.193  
.220  
.291  
.313  
Operating Temperature Range: -40°C to +85°C  
.010  
Humidity per EIA 364-31, method II, condition A  
Temperature Life per EIA 364-17, condition 3, method A  
Solderability per EIA 364-52, category 2 (260°C for 3 seconds)  
.122  
.193  
.404  
FIG. 2  
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com  

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