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87715-9X09 PDF预览

87715-9X09

更新时间: 2024-11-20 06:33:27
品牌 Logo 应用领域
莫仕 - MOLEX 连接器PC
页数 文件大小 规格书
2页 184K
描述
PCI Express* connector

87715-9X09 数据手册

 浏览型号87715-9X09的Datasheet PDF文件第2页 
FEATURES AND SPECIFICATIONS  
1.00mm (.039”) Pitch  
PCI Express* connector  
Molex offers the new PCI Express* revision 2 specs connectors in a through hole  
configuration for high-bandwidth workstation and server applications  
87715  
Vertical, Through Hole  
PCI Express is a third generation I/O architecture. PCI-SIG* recently revised the  
PCI Express specifications from version 1.1 to version 2.0. This revision doubles  
the PCI Express interconnect bit rate from 2.5 GT/s (gigatransfer per second) to  
5 GT/s per lane. Unlike the previous version in which the PCI bus was  
implemented via multi-drop parallel architecture, the PCI Express incorporates a  
point-to-point signaling using differential pairs. A 16-lane link now could provide  
approximately 16Gbps of data-transfer. With this increase in signaling speed,  
the PCI Express now provides better support to high-bandwidth applications. It  
is also backward compatible with current PCI Express 1.1 version products.  
Molex’s through hole connector version of the PCI Express version 2.0 specs  
provides customers design flexibility for a narrower interconnect links. This  
would improve data-transfer at a lower cost.  
All Molex PCI Express connectors are compliant with PCI-SIG* specifications. For  
more information on these specifications please see www.pcisig.com  
*PCI Express, ExpressModule, and PCI-SIG are trademarks of PCI-SIG  
Features  
Benefits  
High-temperature thermoplastic housing  
Complies with PCI-SIG industry specifications  
Withstands lead-free processing  
Allows connectors to support all PCI Express module cards  
available in the market.  
Keying design allows only one mating orientation  
Hot Plugging  
Ensures correct mating of card module to edge card connector  
Allows for insertion and removal of card without system shut  
down, facilitates connection in cramped spaces  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
UL File No.: TBD  
CSA File No.: TBD  
Mates With: PCI Express Card  
Designed In: mm  
Mechanical  
Max Terminal Retention Force: 5 N min/Terminal  
Mating Force: 1.15 N max/contact pair  
Unmating Force: 0.15 N min/contact pair  
Durability: 50 Cycles  
Physical  
Electrical  
Voltage: 50 Volts AC (RMS)/DC  
Current: 1.1A  
Housing: High Temperature Nylon, UL 94V-0  
Contact: Copper Alloy  
Plating:  
Contact Resistance: 30 milliohms max  
Dielectric Withstanding Voltage: 500V AC  
Insulation Resistance: 1000 Megohms min  
Contact Area —0.76 µm Gold or 0.38 µm Gold  
Solder Tail Area — Tin  
Underplating — Nickel  
Operating Temperature: - 55 ºC to +85 ºC  

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